Patents by Inventor Adam J. DeGrush

Adam J. DeGrush has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit edit interconnect structure through the backside of an integrated circuit die
    Patent number: 6376919
    Abstract: A method of making circuit edit structures through the backside of a flip-chip packaged integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the backside. Next, a polyimide layer is vapor deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, the circuit edit connection targets are re-exposed through the polyimide layer and a conductor is deposited over the re-exposed circuit edit connection targets and the deposited polyimide layer from the backside of the integrated circuit to couple together the circuit edit connection targets. The polyimide layer may acts as both an insulation layer and an anti-reflective coating layer.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: April 23, 2002
    Assignee: Intel Corporation
    Inventors: Jian Li, Paul Winer, Adam J. DeGrush, Steven P. Maher
  • Method of making a circuit edit interconnect structure through the backside of an integrated circuit die
    Patent number: 6159754
    Abstract: A method of making circuit edit structures through the backside of a flip-chip packaged integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the backside. Next, a polyimide layer is vapor deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, the circuit edit connection targets are re-exposed through the polyimide layer and a conductor is deposited over the re-exposed circuit edit connection targets and the deposited polyimide layer from the backside of the integrated circuit to couple together the circuit edit connection targets. The polyimide layer may act as both an insulation layer and an anti-reflective coating layer.
    Type: Grant
    Filed: May 7, 1998
    Date of Patent: December 12, 2000
    Assignee: Intel Corporation
    Inventors: Jian Li, Paul Winer, Adam J. DeGrush, Steven P. Maher