Patents by Inventor Adam J. Schwartz

Adam J. Schwartz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic cannabis financial trading platform
    Publication number: 20160042453
    Abstract: An electronic financial market for agricultural financial instruments based on agricultural products such as cannabis financial instruments is provided that provides for price discovery. Information regarding the agricultural products, including information regarding at least one chemical compound present within the agricultural product is received. A pharmaceutical index is included in specifications for agricultural financial instruments. The index is based on the chemical compounds present within the agricultural product. The specification, including the indexing formula, is published, and the agricultural financial instrument is electronically matched.
    Type: Application
    Filed: August 8, 2014
    Publication date: February 11, 2016
    Inventors: Adam J. Schwartz, William Hayhurst
  • Intergranular degradation assessment via random grain boundary network analysis
    Patent number: 6397682
    Abstract: A method is disclosed for determining the resistance of polycrystalline materials to intergranular degradation or failure (IGDF), by analyzing the random grain boundary network connectivity (RGBNC) microstructure. Analysis of the disruption of the RGBNC microstructure may be assess the effectiveness of materials processing in increasing IGDF resistance.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: June 4, 2002
    Assignee: The United States of America as represented by the Department of Energy
    Inventors: Mukul Kumar, Adam J. Schwartz, Wayne E. King
  • Intergranular degradation assessment via random grain boundary network analysis
    Publication number: 20020002865
    Abstract: A method is disclosed for determining the resistance of polycrystalline materials to intergranular degradation or failure (IGDF), by analyzing the random grain boundary network connectivity (RGBNC) microstructure. Analysis of the disruption of the RGBNC microstructure may be assess the effectiveness of materials processing in increasing IGDF resistance. Comparison of the RGBNC microstructures of materials exposed to extreme operating conditions to unexposed materials may be used to diagnose and predict possible onset of material failure due to IGDF.
    Type: Application
    Filed: February 9, 2001
    Publication date: January 10, 2002
    Inventors: Mukul Kumar, Adam J. Schwartz, Wayne E. King