Abstract: Example embodiments provide methods, systems, apparatuses, computer program products and/or the like for reducing diffractive orders arising from metasurface optics. In various embodiments, reducing diffractive orders is achieved by intentional apodization of emergent superstructures and/or intentional amplitude apodization of metasurface apertures. For example, various embodiments provide methods for designing and/or fabricating metasurfaces using a metastructure library that includes parameters defining a plurality of metastructures indexed by respective effective phase delays imparted to light that interacts with the corresponding metastructures. For at least one effective phase delay, the metastructure library comprises parameters that define at least two metastructures that differ in at least one of size or shape and that are indexed by the same effective phase delay.

Abstract: Photonic structures and systems including photonic structures are provided. An example photonic structure includes a plurality of layers. Each layer includes a respective material of two or more materials. Each of the two or more materials has a respective refractive index. A first layer of the plurality of layers is at least partially disposed on a substrate. The respective refractive index of a first material of the two or more materials has a different refractive index than a second material of the two or more materials. Each layer of the plurality of layers has a thickness that is at most one tenth of an intended use wavelength.

Abstract: Embodiments of the disclosure provide apparatuses, systems, and methods related to photonic devices. A method for fabricating photonic devices may include forming a mask layer on a surface of a mold layer. The mask layer may define one or more openings that expose one or more select portions of a surface of the mold layer. The method may include etching through the one or more openings to form one or more cavities within the mold layer and depositing photonic material within the one or more cavities. Depositing the photonic material may include overfilling the one or more cavities to form an over-filled layer on the mask layer. The method may include removing the over-filled layer and the hard mask layer.

Abstract: A resonant photonic element includes a propagation waveguide defining a propagation direction; and a guided mode resonator comprising a periodically perturbed waveguide. The periodically perturbed waveguide is a waveguide that extends a first length in a resonator direction, the resonator direction is transverse to the propagation direction, and the periodically perturbed waveguide intersects the waveguide.

Abstract: A window component of a controlled environment chamber is provided. The window component includes a window plate; a first array of coupling elements disposed on a first surface of the window plate; a second array of coupling elements disposed on a second surface of the window plate; and a plurality of waveguides formed in a volume of the window plate between the first and second surfaces. A respective waveguide of the plurality of waveguides optically connects a respective first coupling element of the first array of coupling elements to a respective coupling element of the second array of coupling elements.

Abstract: A controlled environment chamber is provided. The controlled environment chamber includes a chamber housing and a window component that is secured to the chamber housing. The window component includes a window plate having a first surface that faces away from an interior of the controlled environment chamber and a second surface that faces toward the interior of the controlled environment chamber. The window plate comprises at least one signal manipulation element.

Abstract: An optics-integrated confinement apparatus is provided. The optics-integrated confinement apparatus includes a first substrate, a plurality of electrical components formed on the first substrate, and an on-chip beam delivery system. The plurality of electrical components define a confinement apparatus configured/operable to confine one or more quantum objects. The on-chip beam delivery system includes a waveguide, a coupler, and an optical element. The coupler is configured to couple an optical beam out of the waveguide and toward the optical element. The optical element is configured to modify a polarization of the optical beam and direct the optical beam toward a target location defined by the optics-integrated confinement apparatus.

Abstract: An optical system includes an optical mode filter comprising a metasurface optical element. The metasurface optical element is configured to, in response to an optical beam being incident thereon, emit a selected mode beam with first propagation characteristics and one or more unselected mode beams with respective second propagation characteristic. The first propagation characteristics differ from the respective second propagation characteristics such that a majority of the optical power of the selected mode beam is caused to be incident on at least one of a downstream optical element or a target location and a majority of the optical power of the one or more unselected mode beams is caused to be not incident on the at least one of the downstream optical element or the target location.

Abstract: An optical bench system is provided. The optical bench system includes an array of beam-customized optical components, wherein the array of beam-customized optical components comprises a plurality of beam-customized optical components; and a relay component. Each beam-customized optical component of the plurality of beam-customized optical components is configured to control optical properties of a respective optical beam of a plurality of optical beams to provide a plurality of property-controlled optical beams. The relay component is configured to relay the plurality of property-controlled optical beams to respective target locations of an array of target locations.

Abstract: A composite confinement apparatus assembly is provided. The composite confinement apparatus assembly includes a quantum object confinement apparatus and a photonic platform. The confinement apparatus includes one or more electrical components and is fabricated on a confinement apparatus substrate. The photonic platform includes one or more photonic components that are hosted by a photonic platform substrate. The photonic platform substrate is mechanically coupled to the confinement apparatus substrate to form the composite confinement apparatus assembly.

Abstract: In various embodiments, a quantum object confinement apparatus comprising a plurality of electrodes and configured to define a confinement volume within configured for confining one or more quantum objects therein is provided. The confinement volume defines one or more quantum objects positions. The quantum object confinement apparatus comprises one or more metasurfaces that are configured to be associated with respective quantum object positions. The plurality of metasurfaces comprises of a plurality of transparent conducting oxide metamaterial structures.

Abstract: A method of applying a dielectric coating on a structure array of a component of an electrical device includes applying a first layer of a first dielectric material on a structure array with an atomic layer deposition (ALD) process. The structure array is formed on a substrate and has a plurality of features, each of the plurality of features having an aspect ratio of at least 1:1.

Abstract: A method of applying a dielectric coating on a structure array of a component of an electrical device includes applying a first layer of a first dielectric material on a structure array with an atomic layer deposition (ALD) process or a spin-on cladding process. The structure array has a plurality of features. The method may include applying a second layer of a second dielectric material on the first layer with an evaporation deposition process, a physical vapor deposition process (PVD), or a flux-controlled chemical vapor deposition (CVD) process. The first layer has a first thickness and the second layer has a second thickness that is greater than the first thickness.

Abstract: A method for designing a metasurface is provided. The method may include selecting a first metamaterial structure of a plurality of metamaterial structures of the metasurface; generating a forward light propagation model for the first metamaterial structure; generating a reciprocal light propagation model for the first metamaterial structure using a light manipulation function for the metasurface; determining a first electromagnetic response difference between the forward light propagation model and the reciprocal light propagation model; and determining a first property range of the first metamaterial structure such that the first electromagnetic response difference is optimized.

Abstract: An optics-integrated confinement apparatus system comprises a confinement apparatus chip having a confinement apparatus formed thereon and having at least one apparatus optical element disposed and/or formed thereon.