Abstract: An electronic module cage for receiving an electronic module (such as a pluggable optical module (POM)), includes a cage body mounted to a printed circuit board (PCB), the cage body having a first opening configured to receive an electronic module, the cage body comprising a spring feature, the spring feature configured to apply a biasing pressure to the electronic module in a direction away from the printed circuit board and toward a heat dissipating element such that a surface of the electronic module contacts the heat dissipating element through a second opening in the cage body.