Abstract: Aspects of the present disclosure relate to color compositions and methods of making a printed layer using the color composition as well as an article that can include the printed layer.

Abstract: Aspects of the present disclosure relate to color compositions and methods of making a printed layer using the color composition as well as an article that can include the printed layer.

Abstract: A bladder includes a first polymeric film, a second polymeric film attached to the first polymeric film to form a chamber, and one or more grooves formed in an exterior surface of the chamber. In one configuration, the grooves are formed in the exterior surface of the chamber by subjecting the chamber to a laser-etching process.

Abstract: The present disclosure is directed to articles that have a surface comprising a polymeric material having a printed layer disposed thereon that is durable and flexible. Prior to formation of the printed layer, the surface of the article can comprise a first layer of a first composition disposed on a portion of the polymeric material. The first composition can include a dispersion of uncrosslinked polymers (e.g., a water-borne dispersion of uncrosslinked polymers). The printed layer can be included on an article of footwear, a component of footwear, apparel, a component of apparel, sporting equipment, or a component of sporting equipment.

Abstract: Aspects of the present disclosure relate to color compositions and methods of making a printed layer using the color composition as well as an article that can include the printed layer.

Abstract: A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.