Patents by Inventor Adam L. Cohen

Adam L. Cohen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190218680
    Abstract: A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process. Each of the layers may have a thickness of less than 100 microns. At least one of the layers has a series of indentations formed in an outer edge of the layer such that the indentations can be observed to verify that the device originated from a predetermined source. According to another implementation, a counterfeiting deterrent device includes at least one raised layer having outer edges in the shape of a logo. A light source is configured and arranged to shine a light through a slit in a substrate layer of the device and past an intermediate layer to light up the outer edge of the raised layer. The layers of the device are formed by an additive process and have a thickness of less than 100 microns each.
    Type: Application
    Filed: November 7, 2018
    Publication date: July 18, 2019
    Applicant: Microfabrica Inc.
    Inventors: Gregory P. Schmitz, Michael S. Lockard, Ming-Ting Wu, Eric C. Miller, Adam L. Cohen
  • Publication number: 20190221911
    Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
    Type: Application
    Filed: October 22, 2018
    Publication date: July 18, 2019
    Applicant: Microfabrica Inc.
    Inventors: Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
  • Publication number: 20190212364
    Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.
    Type: Application
    Filed: December 28, 2018
    Publication date: July 11, 2019
    Applicant: University of Southern California
    Inventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
  • Patent number: 10294756
    Abstract: This invention relates generally to articles, devices, and methods for gas hydrate mitigation in deep-sea drilling applications. In certain embodiments, hydrate-phobic surfaces are provided that ensure passive enhancement of flow assurance and prevention of catastrophic failures in deep-sea oil and gas operations.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: May 21, 2019
    Assignee: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: J. David Smith, Kripa K. Varanasi, Gareth H. McKinley, Robert E. Cohen, Adam J. Meuler, Harrison L. Bralower
  • Patent number: 10297421
    Abstract: Embodiments are directed to forming reentrant multi-layer micro-scale or millimeter scale three dimensional structures, parts, components, or devices where each layer is formed from a plurality of deposited materials and more specifically where each layer is formed from at least one metal structural material and at least one organic sacrificial material (e.g. polymer) that are co-planarized and a portion of the sacrificial material located on a plurality of layers is removed after formation of the plurality of layers via one or more plasma etching operations.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: May 21, 2019
    Assignee: Microfabrica Inc.
    Inventors: Rulon J. Larsen, III, Adam L. Cohen
  • Patent number: 10215775
    Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: February 26, 2019
    Assignee: University of Southern California
    Inventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
  • Publication number: 20190017189
    Abstract: Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material.
    Type: Application
    Filed: August 30, 2018
    Publication date: January 17, 2019
    Applicant: Microfabrica Inc.
    Inventors: Adam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang, Uri Frodis, Dale S. McPherson, Dennis R. Smalley
  • Publication number: 20180241112
    Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
    Type: Application
    Filed: February 2, 2018
    Publication date: August 23, 2018
    Applicant: Microfabrica Inc.
    Inventors: Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
  • Publication number: 20180230614
    Abstract: A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process. Each of the layers may have a thickness of less than 100 microns. At least one of the layers has a series of indentations formed in an outer edge of the layer such that the indentations can be observed to verify that the device originated from a predetermined source. According to another implementation, a counterfeiting deterrent device includes at least one raised layer having outer edges in the shape of a logo. A light source is configured and arranged to shine a light through a slit in a substrate layer of the device and past an intermediate layer to light up the outer edge of the raised layer. The layers of the device are formed by an additive process and have a thickness of less than 100 microns each.
    Type: Application
    Filed: February 12, 2018
    Publication date: August 16, 2018
    Applicant: Microfabrica Inc.
    Inventors: Gregory P. Schmitz, Michael S. Lockard, Ming-Ting Wu, Eric C. Miller, Adam L. Cohen
  • Publication number: 20180125497
    Abstract: A tissue clipping apparatus comprises a clip including a proximal end received within a capsule. The clip includes a clip locking member biased to engage a first locking structure of the capsule to lock the clip in the capsule in a closed configuration. The apparatus also comprises a tension member releasably coupling the clip to a proximal end of the device which, during use, remains accessible to a user. The tension member is coupled to the clip by a joint designed to release when subject to a predetermined load to separate the clip from the device, release of the joint releasing the locking member to engage the first locking structure.
    Type: Application
    Filed: January 9, 2018
    Publication date: May 10, 2018
    Inventors: Adam L. COHEN, Bryan R. OGLE, Russell F. DURGIN, Gregory R. FURNISH, Michael GOLDENBOGEN, Gary A. JORDAN, Benjamin E. MORRIS, Mark A. GRIFFIN, Willaim C. Mers KELLY, Vasiliy P. ABRAMOV
  • Publication number: 20180080956
    Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.
    Type: Application
    Filed: December 31, 2015
    Publication date: March 22, 2018
    Inventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
  • Publication number: 20180078274
    Abstract: The present disclosure relates generally to the field of tissue removal and more particularly to methods and devices for use in medical applications involving selective tissue removal. One exemplary method includes the steps of providing a tissue cutting instrument capable of distinguishing between target tissue to be removed and non-target tissue, urging the instrument against the target tissue and the non-target tissue, and allowing the instrument to cut the target tissue while automatically avoiding cutting of non-target tissue. Various tools for carrying out this method are also described.
    Type: Application
    Filed: September 28, 2017
    Publication date: March 22, 2018
    Applicant: Microfabrica Inc.
    Inventors: Michael S. Lockard, Uri Frodis, Adam L. Cohen, Richard T. Chen, Gregory P. Schmitz, Eric C. Miller, Ming Ting Wu, Arun S. Veeramani, Juan Diego Perea, Ronald Leguidleguid, Gregory B. Arcenio
  • Patent number: 9919472
    Abstract: Embodiments are directed to methods of producing devices using modified multi-layer, multi-material electrochemical fabrication processes and/or using a laser cutting processes wherein individual layers or layer groups are formed and then stacked and bonded to produce prototypes or production parts. The methods can reduce the cost and lead time of prototyping when compared with previous multi-layer, multi-material electrochemical fabrication processes and can also reduce the lead time of production quantities, by allowing multiple layers of a multilayer device to be formed simultaneously, e.g. in parallel on the same wafer. Additionally, these methods may be used to extend the maximum height to which parts may practically be made. Finally, the methods allow geometries that are impossible, impractical or difficult to release (e.g. microfluidic devices such as pumps or parts with long, narrow channels) to be fabricated in multiple pieces and then joined after full or partial release.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: March 20, 2018
    Assignee: Microfabrica Inc.
    Inventors: Adam L. Cohen, Michael S. Lockard, Rulon J. Larsen, III, Uri Frodis, Kieun Kim, Dennis R. Smalley
  • Patent number: 9907564
    Abstract: The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices are used in procedures to removal spinal tissue and in other embodiments, similar devices are used to remove thrombus from blood vessel.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: March 6, 2018
    Assignee: Microfabrica Inc.
    Inventors: Michael S. Lockard, Uri Frodis, Adam L. Cohen, Richard T. Chen
  • Patent number: 9895154
    Abstract: A tissue clipping apparatus comprises a clip including a proximal end received within a capsule. The clip includes a clip locking member biased to engage a first locking structure of the capsule to lock the clip in the capsule in a closed configuration. The apparatus also comprises a tension member releasably coupling the clip to a proximal end of the device which, during use, remains accessible to a user. The tension member is coupled to the clip by a joint designed to release when subject to a predetermined load to separate the clip from the device, release of the joint releasing the locking member to engage the first locking structure.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: February 20, 2018
    Assignee: BOSTON SCIENTIFIC SCIMED, Inc.
    Inventors: Adam L. Cohen, Bryan R. Ogle, Russell F. Durgin, Gregory R. Furnish, Michael Goldenbogen, Gary A. Jordan, Benjamin E. Morris, Mark A. Griffin, William C. Mers Kelly, Vasily P. Abramov
  • Publication number: 20170260636
    Abstract: A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process. Each of the layers may have a thickness of less than 100 microns. At least one of the layers has a series of indentations formed in an outer edge of the layer such that the indentations can be observed to verify that the device originated from a predetermined source. According to another implementation, a counterfeiting deterrent device includes at least one raised layer having outer edges in the shape of a logo. A light source is configured and arranged to shine a light through a slit in a substrate layer of the device and past an intermediate layer to light up the outer edge of the raised layer. The layers of the device are formed by an additive process and have a thickness of less than 100 microns each.
    Type: Application
    Filed: December 22, 2016
    Publication date: September 14, 2017
    Applicant: Microfabrica Inc.
    Inventors: Gregory P. Schmitz, Michael S. Lockard, Ming-Ting Wu, Eric C. Miller, Adam L. Cohen
  • Publication number: 20170263994
    Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
    Type: Application
    Filed: December 21, 2016
    Publication date: September 14, 2017
    Applicant: Microfabrica Inc.
    Inventors: Elliott R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
  • Patent number: 9752247
    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: September 5, 2017
    Assignee: University of Southern California
    Inventor: Adam L. Cohen
  • Publication number: 20170247807
    Abstract: Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material.
    Type: Application
    Filed: November 21, 2016
    Publication date: August 31, 2017
    Applicant: Microfabrica Inc.
    Inventors: Adam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang, Uri Frodis, Dale S. McPherson, Dennis R. Smalley
  • Patent number: 9714473
    Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: July 25, 2017
    Assignee: Microfabrica Inc.
    Inventors: Uri Frodis, Adam L. Cohen, Michael S. Lockard