Patents by Inventor Adam Letize

Adam Letize has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITIONS FOR GOLD ELECTRODEPOSITION AND METHOD OF USING THE SAME
    Publication number: 20260242971
    Abstract: A gold electroplating bath comprising (a) a source of gold ions, (b) a sulfite compound, (c) a chelating agent, (d) an organic accelerator, (e) a suppressor, (f) optionally, a pH adjuster, and (g) balance water. The gold electroplating bath can be used for electroplating a gold deposit onto a substrate comprising one or more features.
    Type: Application
    Filed: February 18, 2025
    Publication date: August 20, 2026
    Inventors: Dolores Ross, Brian Gokey, Adam Letize, Thomas B. Richardson, Kyle M. Whitten, Elie H. Najjar
  • High Speed Copper Plating Process
    Publication number: 20140256083
    Abstract: A copper electrolyte comprising a copper nitrate salt is described. The electrolyte is suitable for use in a light induced plating process for metallizing contacts in a photovoltaic solar cell. A method of metallizing an electrical contact in a photovoltaic solar cell using the copper electrolyte is also described.
    Type: Application
    Filed: March 6, 2013
    Publication date: September 11, 2014
    Applicant: MACDERMID ACUMEN, INC.
    Inventors: Eric Yakobson, Adam Letize, Kenneth Crouse
  • Surface treatment of silicon
    Patent number: 7989346
    Abstract: A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) applying a UV etch resist to the treated anti-reflective surface, and c) exposing the anti-reflective surface to a wet chemical etchant composition to remove exposed areas of the anti-reflective surface. Thereafter, the substrate can be metallized to provide a conductor pattern. The method may be used to produce silicon solar cells.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: August 2, 2011
    Inventors: Adam Letize, Andrew M. Krol, Ernest Long, Steven A. Castaldi
  • Surface Treatment of Silicon
    Publication number: 20110021023
    Abstract: A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) applying a UV etch resist to the treated anti-reflective surface, and c) exposing the anti-reflective surface to a wet chemical etchant composition to remove exposed areas of the anti-reflective surface. Thereafter, the substrate can be metallized to provide a conductor pattern. The method may be used to produce silicon solar cells.
    Type: Application
    Filed: July 27, 2009
    Publication date: January 27, 2011
    Inventors: Adam Letize, Andrew M. Krol, Ernest Long, Steven A. Castaldi