Patents by Inventor Adam M. Kennedy

Adam M. Kennedy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240371516
    Abstract: The present disclosure relates to aggregating and sharing wellness data. The wellness data can be received by a user device from any number of sensors external or internal to the user device, from a user manually entering the wellness data, or from other users or entities. The user device can securely store the wellness data on the user device and transmit the wellness data to be stored on a remote database. A user of the device can share some or all of the wellness data with friends, relatives, caregivers, healthcare providers, or the like. The user device can further display a user's wellness data in an aggregated view of different types of wellness data. Wellness data of other users can also be viewed if authorizations from those users have been received.
    Type: Application
    Filed: July 16, 2024
    Publication date: November 7, 2024
    Inventors: Afshad M. MISTRI, Adam L. BEBERG, Anton M. DAVYDOV, Dylan R. EDWARDS, Zachery W. KENNEDY, Zachury B. MINJACK, Dennis S. PARK, Lawrence Y. YANG
  • Patent number: 12094604
    Abstract: The present disclosure relates to aggregating and sharing wellness data. The wellness data can be received by a user device from any number of sensors external or internal to the user device, from a user manually entering the wellness data, or from other users or entities. The user device can securely store the wellness data on the user device and transmit the wellness data to be stored on a remote database. A user of the device can share some or all of the wellness data with friends, relatives, caregivers, healthcare providers, or the like. The user device can further display a user's wellness data in an aggregated view of different types of wellness data. Wellness data of other users can also be viewed if authorizations from those users have been received.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: September 17, 2024
    Assignee: Apple Inc.
    Inventors: Anton M. Davydov, Adam L. Beberg, Dylan R. Edwards, Zachery W. Kennedy, Zachury B. Minjack, Afshad M. Mistri, Dennis S. Park, Lawrence Y. Yang
  • Patent number: 12080421
    Abstract: The present disclosure relates to aggregating and sharing wellness data. The wellness data can be received by a user device from any number of sensors external or internal to the user device, from a user manually entering the wellness data, or from other users or entities. The user device can securely store the wellness data on the user device and transmit the wellness data to be stored on a remote database. A user of the device can share some or all of the wellness data with friends, relatives, caregivers, healthcare providers, or the like. The user device can further display a user's wellness data in an aggregated view of different types of wellness data. Wellness data of other users can also be viewed if authorizations from those users have been received.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: September 3, 2024
    Assignee: Apple Inc.
    Inventors: Aroon Pahwa, Adam L. Beberg, Anton M. Davydov, Dylan R. Edwards, Christine M. Eun, Stephanie M. Greer, Daniel S. Keen, Zachery W. Kennedy, Stephen O. Lemay, Kevin M. Lynch, Natalia C. Maric, Zachury B. Minjack, Afshad M. Mistri, Divya Nag, Gregory B. Novick, Michael O'Reilly, Dennis S. Park, Donald W. Pitschel, Christopher D. Soli, Rebecca L. Weber, Lawrence Y. Yang, Jay K. Blahnik
  • Patent number: 11750945
    Abstract: An imaging and asynchronous laser pulse detector (ALPD) device, imaging cell of the imaging and ALPD device and method of use is disclosed. A detector generates an electrical signal in response to receiving an optical signal, wherein a frequency of the electrical signal is indicative of a frequency of the optical signal. A first detection/readout circuit is sensitive to a first frequency range, and a second detection/readout circuit is sensitive to a second frequency range. The first detection/readout circuit allows the electrical signal to pass from the first detection/readout circuit to the second detection/readout circuit.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: September 5, 2023
    Assignee: RAYTHEON COMPANY
    Inventors: Adam M. Kennedy, Michael J. Batinica, Scott M. Taylor, Sean P. Kilcoyne, Paul Bryant
  • Publication number: 20220310690
    Abstract: A focal plane array includes a mosaic integrated circuit device having a plurality of discrete integrated circuit tiles mounted on a motherboard. The focal plane array includes an optically continuous detector array electrically connected to the mosaic integrated circuit device with an interposer disposed therebetween. The interposer is configured to adjust a pitch of the continuous detector array to match a pitch of each of the plurality of discrete integrated circuit tiles so that the optical gaps between each of the plurality of integrated circuit tiles on the motherboard are minimized and the detector array is optically continuous, having high yield over the large format focal plane array.
    Type: Application
    Filed: March 25, 2021
    Publication date: September 29, 2022
    Inventors: David J. Gulbransen, Sean P. Kilcoyne, Eric Miller, Matthew D. Chambers, Eric J. Beuville, Andrew E. Gin, Adam M. Kennedy
  • Patent number: 11284025
    Abstract: A digital pixel includes a capacitive transimpedance amplifier (CTIA) coupled to a photodiode that receives an electrical charge and output an integration voltage. An integration capacitor coupled to the CTIA accumulates the integration voltage over an integration period. A comparator compares the accumulated integration voltage with a threshold voltage and generates a control signal at a first level each time the accumulated integration voltage is greater than the threshold voltage. A charge subtraction circuit receives the control signal at the first level and discharges the accumulated integration voltage each time the control signal at the first level is received from the comparator. An analog or digital counter receives the control signal at the first level and adjusts a counter value each time the control signal is received from the comparator. An output interface communicates the counter value to an image processing circuit at an end of the integration period.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: March 22, 2022
    Assignee: Raytheon Company
    Inventors: Neil R. Malone, Micky Harris, Adam M. Kennedy, George Paloczi, John L. Vampola, Christian M. Boemler
  • Publication number: 20210377470
    Abstract: A digital pixel includes a capacitive transimpedence amplifier (CTIA) coupled to a photodiode that receives an electrical charge and output an integration voltage. An integration capacitor coupled to the CTIA accumulates the integration voltage over an integration period. A comparator compares the accumulated integration voltage with a threshold voltage and generates a control signal at a first level each time the accumulated integration voltage is greater than the threshold voltage. A charge subtraction circuit receives the control signal at the first level and discharges the accumulated integration voltage each time the control signal at the first level is received from the comparator. An analog or digital counter receives the control signal at the first level and adjusts a counter value each time the control signal is received from the comparator. An output interface communicates the counter value to an image processing circuit at an end of the integration period.
    Type: Application
    Filed: June 2, 2020
    Publication date: December 2, 2021
    Applicant: Raytheon Company
    Inventors: Neil R. Malone, Micky Harris, Adam M. Kennedy, George Paloczi, John L. Vampola, Christian M. Boemler
  • Publication number: 20210227158
    Abstract: An imaging and asynchronous laser pulse detector (ALPD) device, imaging cell of the imaging and ALPD device and method of use is disclosed. A detector generates an electrical signal in response to receiving an optical signal, wherein a frequency of the electrical signal is indicative of a frequency of the optical signal. A first detection/readout circuit is sensitive to a first frequency range, and a second detection/readout circuit is sensitive to a second frequency range. The first detection/readout circuit allows the electrical signal to pass from the first detection/readout circuit to the second detection/readout circuit.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 22, 2021
    Inventors: Adam M. Kennedy, Michael J. Batinica, Scott M. Taylor, Sean P. Kilcoyne, Paul Bryant
  • Patent number: 10451487
    Abstract: Microbolometer arrays incorporating per-pixel dark reference structures for non-uniformity correction.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: October 22, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: Adam M. Kennedy, Eli E. Gordon, Eric J. Beuville, Ryan Paul Boesch, Jeffrey K. Hamers
  • Patent number: 10315918
    Abstract: Methods for reducing wafer bow induced by an anti-reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: June 11, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: Roland W. Gooch, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian, Adam M. Kennedy
  • Patent number: 10267997
    Abstract: A scene projector including an array of light emitting pixels, a tunable filter element, and a spatial light modulator. The tunable filter element is optically coupled to the array of light emitting pixels such that light emitted from the array of light emitting pixels is passed through the tunable filter element as filtered light. The spatial light modulator is optically coupled to the array of light emitting pixels and is configured to generate transmitted light by interacting with the filtered light to control at least one of an amplitude, a phase, and a polarization of the filtered light.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: April 23, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: Justin Gordon Adams Wehner, Duane D. Smith, Edward Peter Gordon Smith, Adam M. Kennedy
  • Patent number: 10262913
    Abstract: An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a detector device and a reference device. In certain examples, a solder barrier layer of titanium material may be deposited onto the surface of the lid wafer. The solder barrier layer of titanium material may further be activated to function as a getter. In various examples, the lid wafer and the device wafer may be bonded together using solder, and the solder barrier layer of titanium material may prevent the solder from contacting the surface of the lid wafer.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: April 16, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian
  • Publication number: 20180226309
    Abstract: An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a detector device and a reference device. In certain examples, a solder barrier layer of titanium material may be deposited onto the surface of the lid wafer. The solder barrier layer of titanium material may further be activated to function as a getter. In various examples, the lid wafer and the device wafer may be bonded together using solder, and the solder barrier layer of titanium material may prevent the solder from contacting the surface of the lid wafer.
    Type: Application
    Filed: April 2, 2018
    Publication date: August 9, 2018
    Inventors: Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian
  • Patent number: 9969610
    Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: May 15, 2018
    Assignee: RAYTHEON COMPANY
    Inventors: Buu Q. Diep, Adam M. Kennedy, Thomas Allan Kocian, Mark Lamb
  • Patent number: 9966320
    Abstract: An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a detector device and a reference device. In certain examples, a solder barrier layer of titanium material may be deposited onto the surface of the lid wafer. The solder barrier layer of titanium material may further be activated to function as a getter. In various examples, the lid wafer and the device wafer may be bonded together using solder, and the solder barrier layer of titanium material may prevent the solder from contacting the surface of the lid wafer.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: May 8, 2018
    Assignee: RAYTHEON COMPANY
    Inventors: Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian
  • Patent number: 9865519
    Abstract: A system and method for forming a wafer level package. In one example, a substrate used in the wafer level package includes a surface defined by a wafer level package (WLP) region and an external region, and a layer of getter material is disposed on at least a portion of the external region. According to one embodiment, the external region comprises a saw-to-reveal (STR) region of the wafer.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: January 9, 2018
    Assignee: RAYTHEON COMPANY
    Inventors: Stephen H. Black, Adam M. Kennedy
  • Patent number: 9771258
    Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: September 26, 2017
    Assignee: RAYTHEON COMPANY
    Inventors: Buu Q. Diep, Adam M. Kennedy, Thomas Allan Kocian, Mark Lamb
  • Patent number: 9708181
    Abstract: A sealed package having a device disposed on a wafer structure and a lid structure boned to the device wafer. The device wafer includes: a substrate; a metal ring disposed on a surface portion of substrate around the device and a bonding material disposed on the metal ring. The metal ring extends laterally beyond at least one of an inner and outer edge of the bonding material. A first layer of the metal ring includes a stress relief buffer layer having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: July 18, 2017
    Assignee: Raytheon Company
    Inventors: Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas Allan Kocian, Gregory D. Tracy
  • Publication number: 20170148695
    Abstract: A surface defined by a wafer level package (WLP) region and an external region, and A system and method for forming a wafer level package. In one example, a substrate used in the wafer level package includes a layer of getter material is disposed on at least a portion of the external region. According to one embodiment, the external region comprises a saw-to-reveal (STR) region of the wafer.
    Type: Application
    Filed: January 10, 2017
    Publication date: May 25, 2017
    Inventors: Stephen H. Black, Adam M. Kennedy
  • Publication number: 20170129775
    Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.
    Type: Application
    Filed: January 26, 2017
    Publication date: May 11, 2017
    Inventors: Buu Q. Diep, Adam M. Kennedy, Thomas Allan Kocian, Mark Lamb