Patents by Inventor Adam M. Rowen

Adam M. Rowen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplated Au for conformal coating of high aspect ratio silicon structures
    Patent number: 11053601
    Abstract: A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: July 6, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Adam M. Rowen, Robert K. Grubbs, Jonathan Joseph Coleman
  • Electroplated Au for Conformal Coating of High Aspect Ratio Silicon Structures
    Publication number: 20190074100
    Abstract: A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.
    Type: Application
    Filed: October 30, 2018
    Publication date: March 7, 2019
    Inventors: Adam M. Rowen, Robert K. Grubbs, Jonathan Joseph Coleman
  • Electroplated AU for conformal coating of high aspect ratio silicon structures
    Patent number: 10147510
    Abstract: A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: December 4, 2018
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Adam M. Rowen, Robert K. Grubbs, Jonathan Joseph Coleman