Patents by Inventor Adam Manzonie

Adam Manzonie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Eliminating air pockets under a polished pad
    Patent number: 6561891
    Abstract: A polishing pad assembly is provided that is useful for the chemical mechanical polishing of glass and electrical devices such as semiconductor wafers that comprises a polish pad and a semi-rigid base material firmly adhered to the polishing pad for positioning on a polishing platen of a polishing machine; wherein the semi-rigid base material has a modulus of rigidity of 0.01-50 GPa (GigaPascals) determined according to ASTM D 790, a thickness of 0.25-15.0 mm, and a grooved surface having a pitch of 5-100 mm and the grooves have a width of 0.025-2.5 mm and a depth of 0.1-2.5 mm.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: May 13, 2003
    Assignee: Rodel Holdings, Inc.
    Inventors: Stanley E. Eppert, Jr., Adam Manzonie, Peter W. Freeman, Elizabeth A. Langlois
  • Eliminating air pockets under a polishing pad
    Publication number: 20020002027
    Abstract: A polishing pad assembly is provided that is useful for the chemical mechanical polishing of glass and electrical devices such as semiconductor wafers that comprises a polish pad and a semi-rigid base material firmly adhered to the polishing pad for positioning on a polishing platen of a polishing machine; wherein the semi-rigid base material has a modulus of rigidity of 0.01-50 GPa (GigaPascals) determined according to ASTM D 790, a thickness of 0.25-15.0 mm, and a grooved surface having a pitch of 5-100 mm and the grooves have a width of 0.025-2.5 mm and a depth of 0.1-2.5 mm.
    Type: Application
    Filed: May 22, 2001
    Publication date: January 3, 2002
    Inventors: Stanley E. Eppert, Adam Manzonie, Peter W. Freeman, Elizabeth A. Langlois
  • Polishing pad for chemical-mechanical planarization of a semiconductor wafer
    Patent number: 5910043
    Abstract: The present invention is a polishing pad that planarizes and cleans a semiconductor wafer in chemical-mechanical planarization processes. The polishing pad has a polishing body and a cleaning element positioned in the polishing body. The polishing body includes a planarizing surface, a basin formed in the body, and an opening at the planarizing surface defined by the basin. The cleaning element is positioned in the basin so that a cleaning surface of the cleaning element is positioned in the opening proximate to a plane defined by the planarizing surface. In operation, the cleaning surface periodically engages the wafer when the wafer is engaged with the pad to remove residual materials from the surface of the wafer.
    Type: Grant
    Filed: April 13, 1998
    Date of Patent: June 8, 1999
    Assignee: Micron Technology, Inc.
    Inventors: Adam Manzonie, Salman Akram
  • Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor
    Patent number: 5899745
    Abstract: A chemical mechanical polishing (CMP) method utilizes a polishing pad (21) and an under pad (20). The under pad (20) has an edge portion (24) and a central portion (22). The central portion (22) has either a shore D hardness less than a shore D hardness of the portion (24), greater slurry absorption than the edge portion (24), or more compressibility than the edge portion (24). This composite material under pad (20) will improve polishing uniformity of a semiconductor wafer (39). In addition, the use of the polishing pads (20 and 21) allows for greater final wafer profile control than was previously available in the art (FIGS. 4-6).
    Type: Grant
    Filed: July 3, 1997
    Date of Patent: May 4, 1999
    Assignee: Motorola, Inc.
    Inventors: Sung C. Kim, Lei Ping Lai, Rajeev Bajaj, Adam Manzonie
  • Polishing pad for chemical-mechanical planarization of a semiconductor wafer
    Patent number: 5738567
    Abstract: The present invention is a polishing pad that planarizes and cleans a semiconductor wafer in chemical-mechanical planarization processes. The polishing pad has a polishing body and a cleaning element positioned in the polishing body. The polishing body includes a planarizing surface, a basin formed in the body, and an opening at the planarizing surface defined by the basin. The cleaning element is positioned in the basin so that a cleaning surface of the cleaning element is positioned in the opening proximate to a plane defined by the planarizing surface. In operation, the cleaning surface periodically engages the wafer when the wafer is engaged with the pad to remove residual materials from the surface of the wafer.
    Type: Grant
    Filed: August 20, 1996
    Date of Patent: April 14, 1998
    Assignee: Micron Technology, Inc.
    Inventors: Adam Manzonie, Salman Akram