Abstract: A temperature compensation apparatus for an oscillator includes an oscillator having an output for generating a clock signal with a frequency identical to the oscillating frequency of the oscillator, a memory for storing a frequency compensation lookup table based on the relationship between output frequencies of the oscillator and the environmental temperature variations, a temperature detector for detecting the environmental temperature variations, a central processing unit for selecting a rating output frequency of the oscillator, acquiring a frequency compensation value from the frequency compensation lookup table stored in the memory in response to a detected environmental temperature, and converting the frequency compensation value into a corresponding compensation signal, and a compensation circuit receiving an output signal of the oscillator and a compensation signal from the CPU for compensating a deviation between the output frequency of the oscillator and the rating frequency and outputting a frequ

Abstract: A glass tube lamp matrix device includes a working gas container set and a glass tube matrix. The working gas container set includes a plurality of parallel first elongated containers in a plane and a plurality of parallel second elongated containers crossing the first elongated containers in a plane and forming an angle therewith. Each of the first and second elongated containers contains a working gas therein. The glass tube matrix includes a plurality of thin glass tubes, each of which having two open ends which are fluidly and respectively communicated with one of the first elongated containers and one of the second elongated containers, thereby filling the glass tubes with the working gas. Each of the glass tubes has a cross-sectional area much smaller than that of the first and second elongated containers.

Abstract: A semiconductor element string having a number of semiconductor elements, each of which has the first and second leads mounted on a transverse plate. The first leads are cut off from the transverse plate, when the semiconductor element string is to be mounted on the printed circuit board. The second leads connected to the transverse plate serve as the ground lines for the respective semiconductor elements by bending two distal ends of the transverse plate to be mounted on the printed circuit board. A linking piece is provided crossing over the middle portions of the first and second leads so as to make the whole construction more stable. The second leads are bent into a S-shaped structure. Each second lead and its corresponding first lead are located on a first vertical plane which intersects with a second vertical plane passing through a common longitudinal axis of the semiconductor element string by an angle.

Abstract: A semiconductor element string having a number of semiconductor elements mounted on a lead frame. The lead frame has a transverse plate, an assembling plate and a number of first and second leads respectively connected to the transverse plate and the assembling plate. The lead frame is used to form the semiconductor element string by soldering the semiconductor elements on the end portions of the first and second leads. When forming the semiconductor element string, one of the leads of each of the semiconductor elements in the string is connected to the transverse plate.

Abstract: A semiconductor string connection structure comprising a plurality of encasements, each of which has a light emitting diode chip and a pair of conducting leads, a plurality of binding pieces connected between the encasements, a plurality of longitudinal pieces disposed between two pairs of the conducting leads or at the right-most or left-most side thereof, a plurality of transverse thin pieces connected with the leads and longitudinal pieces, and a transverse plate disposed and connected with lower ends of the leads and longitudinal piece. The transverse plate serves as a common line, therefore, the lower half of the semiconductor string connection structure is folded 180 degrees such that the whole structure can be mounted on a circuit board to form a large display.