Patents by Inventor Adam P. La Bell

Adam P. La Bell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for conditioning a polishing pad
    Patent number: 7175510
    Abstract: A method and apparatus for polishing a thin film on a semiconductor substrate is described. A polishing pad is rotated and a wafer to be polished is placed on the rotating polishing pad. The polishing pad has grooves that channels slurry between the wafer and polishing pad and rids excess material from the wafer, allowing an efficient polishing of the surface of the wafer. The polishing pad smoothes out due to the polishing of the wafer and must be conditioned to restore effectiveness. A conditioning assembly with a plurality of diamonds is provided. The diamonds have predetermined angles that provide strength to the diamond. This allows for an optimal rotation speed and downward force in effective conditioning of the polishing pad, while reducing diamond fracture rate.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: February 13, 2007
    Assignee: Intel Corporation
    Inventors: Randy S. Skocypec, Adam P. La Bell, Wade R. Whisler
  • Method and apparatus for conditioning a polishing pad
    Patent number: 7097542
    Abstract: A method and apparatus for polishing a thin film on a semiconductor substrate is described. A polishing pad is rotated and a wafer to be polished is placed on the rotating polishing pad. The polishing pad has grooves that channels slurry between the wafer and polishing pad and rids excess material from the wafer, allowing an efficient polishing of the surface of the wafer. The polishing pad smoothes out due to the polishing of the wafer and must be conditioned to restore effectiveness. A conditioning assembly with a plurality of diamonds is provided. The diamonds have predetermined angles that provide strength to the diamond. This allows for an optimal rotation speed and downward force in effective conditioning of the polishing pad, while reducing diamond fracture rate.
    Type: Grant
    Filed: July 26, 2004
    Date of Patent: August 29, 2006
    Assignee: Intel Corporation
    Inventors: Randy S. Skocypec, Adam P. La Bell, Wade R. Whisler