Patents by Inventor Adam Q. Miller

Adam Q. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6521048
    Abstract: A chemical vapor deposition (CVD) apparatus is provided. The CVD apparatus comprises a deposition chamber and a main chamber. The deposition chamber comprises at least one single injector and one or more exhaust channels. The main chamber supports the deposition chamber and includes at least one gas inlet to inject at least one gas into the main chamber. The gases are removed through the exhaust channels, thereby creating an inwardly flowing purge which acts to isolate the deposition chamber. At least one semi-seal is formed between the deposition chamber and the substrate which acts to confine reactive chemicals within each deposition region.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: February 18, 2003
    Assignee: ASML US, Inc.
    Inventors: Adam Q. Miller, Daniel M. Dobkin
  • Publication number: 20010004881
    Abstract: An injector and deposition chamber for delivering gases to a substrate or wafer for processing of said substrate or wafer is provided. The injector is provided comprising an elongated member with end surfaces and at least one gas delivery surface extending along the length of the member and which includes a number of first elongated passages formed therein for received a gas. The gas delivery surface contains rounded side regions and a center recessed region. Also formed within the member are a number of thin distribution channels which extend between the first elongated passages and the center recessed region of the gas delivery surface. In another embodiment, the injector further includes at least one second elongated passage formed therein for receiving an etchant species. The etchant species is conveyed via at least one thin distribution channel which extends between the second elongated passage and one of the rounded side regions of the gas delivery surface.
    Type: Application
    Filed: January 9, 2001
    Publication date: June 28, 2001
    Applicant: Silicon Valley Group Thermal Systems LLC
    Inventors: Adam Q. Miller, Daniel M. Dobkin
  • Patent number: 6200389
    Abstract: A deposition chamber for delivering gases to a substrate or wafer for processing of said substrate or wafer is provided. The injector is provided comprising an elongated member with end surfaces and at least one gas delivery surface extending along the length of the member and which includes a number of first elongated passages formed therein for received a gas. Also formed within the member are a number of thin distribution channels which extend between the first elongated passages and the gas delivery surface. In another embodiment, the injector further includes at least one second elongated passage formed therein for receiving an etchant species. Metering tubes may be inserted into each elongated passage and are spaced from the walls of said passages and extend between the ends.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: March 13, 2001
    Assignee: Silicon Valley Group Thermal Systems LLC
    Inventors: Adam Q. Miller, Daniel M. Dobkin
  • Patent number: 6022414
    Abstract: A single body injector for delivering gases to a surface is provided. The injector is comprised of an elongated member with end surfaces and at least one gas delivery surface extending along the length of the member and which includes a number of elongated passages formed therein. Also formed within the member are a number of thin distribution channels which extend between the elongated passages and the gas delivery surface. In another embodiment of the invention a number of metering tubes may be inserted into each elongated passage and are spaced from the walls of the passages and extend between the ends. Gases are conveyed to the elongated passages, through the distribution channels to the gas delivery surface where they are directed to a desired region where they mix, react and form a uniform thin film on the substrate positioned beneath the injector.
    Type: Grant
    Filed: July 14, 1997
    Date of Patent: February 8, 2000
    Assignee: Semiconductor Equipment Group, LLC
    Inventors: Adam Q. Miller, Daniel M. Dobkin
  • Patent number: 5935647
    Abstract: A method of manufacturing an injector for chemical vapor deposition (CVD) processing is provided. The method comprises the steps of selecting an elongated member of solid material having first and second ends and a gas delivery surface. At least one elongated passage for receiving a gas is formed in the elongated member and extending between the ends. At least one elongated distribution channel is formed by wire electrode discharge machining (EDM) extending from the elongated passage to the gas delivery surface for providing gas to the gas delivery surface.
    Type: Grant
    Filed: June 4, 1997
    Date of Patent: August 10, 1999
    Assignee: WJ Semiconductor Equipment Group, Inc.
    Inventors: Jay B. DeDontney, Nicholas M. Gralenski, Adam Q. Miller
  • Patent number: 5683516
    Abstract: A single body injector for delivering gases to a surface. The injector includes a single elongated block with one or more passages formed in the block and communicating with a gas delivery surface via thin channels which extend between the passages and the gas delivery surface. Metering tubes may be placed in the passages to control the profile of the gases delivered.
    Type: Grant
    Filed: March 22, 1996
    Date of Patent: November 4, 1997
    Assignee: Watkins-Johnson Co.
    Inventors: Jay B. DeDontney, Nicholas M. Gralenski, Adam Q. Miller