Abstract: An apparatus includes a Dewar having an endcap. The apparatus also includes a heat sink and a thermal interface material configured to thermally couple the endcap of the Dewar to the heat sink. The thermal interface material includes an amorphous pliable material that is configured to transfer thermal energy between the endcap of the Dewar and the heat sink without structurally coupling the Dewar to the heat sink. A thermal shoe may be positioned between the thermal interface material and the heat sink, and the thermal shoe may be configured to hold the thermal interface material against the endcap. The thermal shoe may have (i) a smaller cross-sectional size in a portion of the thermal shoe contacting the thermal interface material and (ii) a larger cross-sectional size in a portion of the thermal shoe contacting the heat sink.

Abstract: An apparatus includes a Dewar having an endcap. The apparatus also includes a heat sink and a multiaxial thermal shoe having a thermal interface material and configured to thermally couple the endcap of the Dewar to the heat sink via one of at least two axial surfaces. The multiaxial thermal shoe is configured to transfer thermal energy between the endcap of the Dewar and the heat sink without structurally coupling the Dewar to the heat sink. The multiaxial thermal shoe may be configured to hold the thermal interface material against the endcap. The multiaxial thermal shoe may couple to the heat sink via a first axial surface in-line with an optical centerline or a second axial surface crosswise to the optical centerline.

Abstract: An apparatus includes a Dewar having an endcap. The apparatus also includes a heat sink and a thermal interface material configured to thermally couple the endcap of the Dewar to the heat sink. The thermal interface material includes an amorphous pliable material that is configured to transfer thermal energy between the endcap of the Dewar and the heat sink without structurally coupling the Dewar to the heat sink. A thermal shoe may be positioned between the thermal interface material and the heat sink, and the thermal shoe may be configured to hold the thermal interface material against the endcap. The thermal shoe may have (i) a smaller cross-sectional size in a portion of the thermal shoe contacting the thermal interface material and (ii) a larger cross-sectional size in a portion of the thermal shoe contacting the heat sink.

Abstract: An apparatus includes a base that includes a raised surface and a first opening through the raised surface. The apparatus also includes a cover configured to be coupled to the base in order to form a cavity, where the cover includes a second opening through the cover. The raised surface is configured to allow passage of a first portion of optical energy through the first opening and to reflect a second portion of the optical energy. Portions of the cover and the base surrounding the cavity are configured to absorb the reflected second portion of the optical energy. The base may further include one or more baffles positioned around the raised surface, and/or the cover may further include one or more baffles positioned around the second opening.

Abstract: An apparatus includes a base that includes a raised surface and a first opening through the raised surface. The apparatus also includes a cover configured to be coupled to the base in order to form a cavity, where the cover includes a second opening through the cover. The raised surface is configured to allow passage of a first portion of optical energy through the first opening and to reflect a second portion of the optical energy. Portions of the cover and the base surrounding the cavity are configured to absorb the reflected second portion of the optical energy. The base may further include one or more baffles positioned around the raised surface, and/or the cover may further include one or more baffles positioned around the second opening.