Patents by Inventor Adam R. Zbrzezny

Adam R. Zbrzezny has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same
    Patent number: 7888259
    Abstract: An integrated circuit package employs a solder pad that includes a predetermined three dimensional surface that is adapted to receive solder. In one example, the predetermined three dimensional surface includes at least one predetermined hill or protruding portion and a valley portion, such as a lower portion, having a predetermined relative height between the hill portion and a valley portion. The predetermined three dimensional surface can be configured in any suitable configuration and may include contoured patterns, non-patterns, or any other suitable configuration as desired. A related method is also described.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: February 15, 2011
    Assignee: ATI Technologies ULC
    Inventors: Adam R. Zbrzezny, Roden R. Topacio
  • INTEGRATED CIRCUIT PACKAGE EMPLOYING PREDETERMINED THREE-DIMENSIONAL SOLDER PAD SURFACE AND METHOD FOR MAKING SAME
    Publication number: 20100044884
    Abstract: An integrated circuit package employs a solder pad that includes a predetermined three dimensional surface that is adapted to receive solder. In one example, the predetermined three dimensional surface includes at least one predetermined hill or protruding portion and a valley portion, such as a lower portion, having a predetermined relative height between the hill portion and a valley portion. The predetermined three dimensional surface can be configured in any suitable configuration and may include contoured patterns, non-patterns, or any other suitable configuration as desired. A related method is also described.
    Type: Application
    Filed: August 19, 2008
    Publication date: February 25, 2010
    Applicant: ATI Technologies ULC
    Inventors: Adam R. Zbrzezny, Roden R. Topacio