Abstract: This disclosure relates to a lead frame assembly for a semiconductor device, a semiconductor device and an associated method of manufacture. The lead frame assembly includes a die attach structure and a clip frame structure. The clip frame structure includes a die connection portion configured to contact a contact terminal on a top side of the semiconductor die; and a continuous lead portion extending along the die connection portion. The continuous lead portion is integrally formed with the die connection portion.

Abstract: A surface mount semiconductor device and method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with said metallic material.

Abstract: A semiconductor device is provided that includes a lead frame, a die attached to the lead frame using a first solder, a clip attached to the die using a second solder, and a copper slug attached to the clip. First gull wing leads are attached to the leadframe for a drain connection of the semiconductor device. Second gull wing leads are attached to the clip for a gate connection and for a source connection of the semiconductor device.

Abstract: The disclosure relates to a lead frame assembly for a semiconductor device, the lead frame assembly including: a die attach structure and clip frame structure. The clip frame structure includes: a die connection portion configured to contact to one or more contact terminals on a top side of the semiconductor die; one or more electrical leads extending from the die connection portion at a first end, and a lead supporting member extending from a second end of the one or more leads; and a plurality of clip support members arranged orthogonally to the one or more electrical leads. The plurality of support members and the lead supporting member are configured to contact the die attach structure. The present disclosure also relates a die attach structure and clip frame structure for a semiconductor device, a semiconductor device including the same and a method of manufacturing the semiconductor device.

Abstract: This disclosure relates to a lead frame assembly for a semiconductor device, a semiconductor device and an associated method of manufacture. The lead frame assembly includes a die attach structure and a clip frame structure. The clip frame structure includes a die connection portion configured to contact a contact terminal on a top side of the semiconductor die; and a continuous lead portion extending along the die connection portion. The continuous lead portion is integrally formed with the die connection portion.

Abstract: The present disclosure relates to a lead frame assembly for a semiconductor device. The leadframe assembly includes a clip frame structure with a die connection portion configured and arranged for contacting to one or more contact terminals on a top side of a semiconductor die; and one or more electrical leads extending from the die connection portion at a first end. The die connection portion includes a hooking tab extending therefrom configured and arranged to engage with a wire loop of a wire pull test equipment. The disclosure also relates to an interconnected matrix of such leadframe.

Abstract: A field effect transistor semiconductor device having a compact device footprint for use in automotive and hot swap applications. The device includes a plurality of field effect transistor cells with the plurality of transistor cells having at least one low threshold voltage transistor cell and at least one high threshold voltage transistor cell arranged on a substrate. The field effect transistor semiconductor device is configured and arranged to operate the at least one high threshold voltage transistor cell during linear mode operation, and operate both the low threshold voltage transistor cell and the high threshold voltage transistor cell during resistive mode operation. Further provided is a method of operating field effect transistor semiconductor device including a plurality of field effect transistor cells that includes at least one low threshold voltage transistor cell and at least one high threshold voltage transistor cell.

Abstract: The present disclosure relates to a lead frame assembly for a semiconductor device. The leadframe assembly includes a clip frame structure with a die connection portion configured and arranged for contacting to one or more contact terminals on a top side of a semiconductor die; and one or more electrical leads extending from the die connection portion at a first end. The die connection portion includes a hooking tab extending therefrom configured and arranged to engage with a wire loop of a wire pull test equipment. The disclosure also relates to an interconnected matrix of such leadframe.

Abstract: A field effect transistor semiconductor device having a compact device footprint for use in automotive and hot swap applications. The device includes a plurality of field effect transistor cells with the plurality of transistor cells having at least one low threshold voltage transistor cell and at least one high threshold voltage transistor cell arranged on a substrate. The field effect transistor semiconductor device is configured and arranged to operate the at least one high threshold voltage transistor cell during linear mode operation, and operate both the low threshold voltage transistor cell and the high threshold voltage transistor cell during resistive mode operation. Further provided is a method of operating field effect transistor semiconductor device including a plurality of field effect transistor cells that includes at least one low threshold voltage transistor cell and at least one high threshold voltage transistor cell.

Abstract: The disclosure relates to a lead frame assembly for a semiconductor device, the lead frame assembly including: a die attach structure and clip frame structure. The clip frame structure includes: a die connection portion configured to contact to one or more contact terminals on a top side of the semiconductor die; one or more electrical leads extending from the die connection portion at a first end, and a lead supporting member extending from a second end of the one or more leads; and a plurality of clip support members arranged orthogonally to the one or more electrical leads. The plurality of support members and the lead supporting member are configured to contact the die attach structure. The present disclosure also relates a die attach structure and clip frame structure for a semiconductor device, a semiconductor device including the same and a method of manufacturing the semiconductor device.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. The semiconductor package includes a leadframe having a die attach portion and a lead portion; a semiconductor die mounted on the die attach portion, the semiconductor die having a contact terminal arranged thereon; a clip portion having: a first tab portion receivably mounted in a hole in the lead portion, and a second tab portion arranged on either side of the first tab portion. The second tab portions are fixedly mounted to connect the clip portion to the lead portion.

Abstract: A field effect transistor semiconductor device having a compact device footprint for use in automotive and hot swap applications. The device includes a plurality of field effect transistor cells with the plurality of transistor cells having at least one low threshold voltage transistor cell and at least one high threshold voltage transistor cell arranged on a substrate. The field effect transistor semiconductor device is configured and arranged to operate the at least one high threshold voltage transistor cell during linear mode operation, and operate both the low threshold voltage transistor cell and the high threshold voltage transistor cell during resistive mode operation. Further provided is a method of operating field effect transistor semiconductor device including a plurality of field effect transistor cells that includes at least one low threshold voltage transistor cell and at least one high threshold voltage transistor cell.

Abstract: A surface mount semiconductor device and method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with said metallic material.

Abstract: An airfoil 11 for attachment to a hub 13 of a windmill 15 or other turbomachine, the airfoil 11 comprises a leading rod 17 and a trailing rod 27, the leading rod 17 and trailing rod 27 preferably are flexible and able to deflect in a direction opposite to that of the direction of rotation, the leading rod 17 having a first end 19 and a second end 21, the first end 19 secured by a leading rod mount 23 of the hub 13 located at a leading mount location 25, the trailing rod 27 has a base end 29 and a tip end 31, the tip end 31 connected with the second end 21 of the leading rod 17, and the base end 29 secured by a trailing rod mount 33 of the hub 13 located at a trailing mount location 35, and fabric sleeve 37 is stretched over the leading rod 17 and the trailing rod 27; the aerodynamic characteristics of each airfoil are configurable by modifying the orientation of the position/alignment of the leading red 17 relative to the trailing rod 27; and the invention including an assembly of airfoils attached to a hub 1

Abstract: An airfoil 11 for attachment to a hub 13 of a windmill 15 or other turbomachine, the airfoil 11 comprises a leading rod 17 and a trailing rod 27, the leading rod 17 and trailing rod 27 preferably are flexible and able to deflect in a direction opposite to that of the direction of rotation, the leading rod 17 having a first end 19 and a second end 21, the first end 19 secured by a leading rod mount 23 of the hub 13 located at a leading mount location 25, the trailing rod 27 has a base end 29 and a tip end 31, the tip end 31 connected with the second end 21 of the leading rod 17, and the base end 29 secured by a trailing rod mount 33 of the hub 13 located at a trailing mount location 35, and fabric sleeve 37 is stretched over the leading rod 17 and the trailing rod 27; the aerodynamic characteristics of each airfoil are configurable by modifying the orientation of the position/alignment of the leading red 17 relative to the trailing rod 27; and the invention including an assembly of airfoils attached to a hub 1