Patents by Inventor Adam Schmitt

Adam Schmitt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230096835
    Abstract: Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes operational bridge bumps to electrically connect the die to a bridge within the substrate. The apparatus also includes dummy bumps adjacent the operational bridge bumps.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Kyle McElhinny, Bohan Shan, Hongxia Feng, Xiaoying Guo, Adam Schmitt, Jacob Vehonsky, Steve Cho, Leonel Arana