Abstract: A flexible circuit board is described that includes a flexible substrate, at least one ridge defining a flexion zone and a component mounting area. The flexion zone acting to dissipate at least a portion of a force applied to the substrate, so as to insulate the component mounting area from the force. Light sources using such flexible circuit boards and methods for making such circuit boards are also described.

Abstract: Described herein are electronic assemblies including a subassembly film and methods for making the same. In some embodiments, a first subassembly is formed by placing an electronic die at a die placement location on a subassembly film. A second subassembly may be formed by placing the first subassembly at a subassembly placement position on a base layer, such that electrical contacts/traces on the first film overlap with electrical contacts/traces at a subassembly connection point on the base layer. Placement of the die on the subassembly film may be performed with automatic placement machinery that has a placement accuracy that is greater than that required to place the first subassembly on the base layer. As a result, the costly and time consuming manual inspection of die placement may be avoided.

Abstract: Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge (“ESD”) events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against low level ESD events by one or more diodes that are electrically coupled thereto. The one or more diodes may be thin film diodes comprising at least one layer of p-type semiconductive material and at least one layer of n-type semiconductive material. Devices including ESD protection and methods for manufacturing such devices are also described.

Abstract: An optical disk for use in converting light emitted from a light-emitting diode chip to white light. The optical disk includes a tapered surface such that a center area of the disk has a width greater than a width of an outer area of the disk. The optical disk is formed of a silicone having at least one weight percent mix of phosphor. Various embodiments of this generally described optical disk are also presented.

Abstract: A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

Abstract: The restrike time for re-light up of an arc discharge lamp may be decreased by including at least one refractory bimetallic start up electrode that provides a shorter arc path intermediate the main arc path in a cool state, but when heated withdraws to have a relatively longer arc path. The longer arc path in the hot state results in a relatively higher path impedance that can be used by itself or in combination with a supplemental impedance device to extinguish the starting arc in favor of the main arc. The withdrawn bimetallic starting electrode then does not interfere with the main arc function.

Abstract: The restrike time for re-light up of an arc discharge lamp may be decreased by including at least one refractory bimetallic start up electrode that provides a shorter arc path intermediate the main arc path in a cool state, but when heated withdraws to have a relatively longer arc path. The longer arc path in the hot state results in a relatively higher path impedance that can be used by itself or in combination with a supplemental impedance device to extinguish the starting arc in favor of the main arc. The withdrawn bimetallic starting electrode then does not interfere with the main arc function.

Abstract: An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.