Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

Abstract: A stand assembly for an electronic device includes a neck portion with a first end that holds and extends from the electronic device, a spine portion that is coupled via a joint structure to a second end of the neck portion, the joint structure being configured to provide a first rotational degree of freedom of the neck portion with respect to the spine portion, and one or more interconnect wires. The one or more interconnect wires include a first wire portion, a second wire portion and a third wire portion, the first wire portion being routed through an interior of the neck portion, the second wire portion being routed along a surface of the spine portion, and the third wire portion being routed though the joint structure from the surface of the spine portion to the interior of the neck portion.

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

Abstract: The various implementations described herein include methods, devices, and systems for illuminating and capturing scenes. In one aspect, a video camera assembly includes: (1) one or more processors configured to operate the video camera assembly in a day mode and in a night mode; (2) an image sensor having a field of view of a scene and configured to capture video of a first portion of the scene while in the day mode of operation and in the night mode of operation, the first portion corresponding to the field of view of the image sensor; (3) one or more infrared (IR) illuminators configured to provide illumination during the night mode of operation while the image sensor captures video; and (4) an IR reflector component configured to: (i) substantially restrict the illumination onto the first portion of the scene, and (ii) illuminate the first portion in a substantially uniform manner across the field of view of the image sensor.

Abstract: This application discloses a stand assembly that includes a receiving element for physically receiving a module, and a base assembly for supporting the receiving element. The receiving element further includes a module holding structure, an extended portion, and a first fastener structure coupled to an end of the extended portion. The base assembly includes a base, and a second fastener structure coupled to the base at a joint and configured to mate with the first fastener structure. The first fastener structure and the joint are configured to respectively provide a first degree of freedom of motion and a second degree of freedom of motion of the receiving element with respect to the base. The movement of the receiving element at the first degree of freedom has substantially consistent resistance through first part of a first full range of motion associated with the first degree of freedom of motion.

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

Abstract: This application is directed to a lens assembly configured to focus light on a sensor array of an optical device. The lens assembly comprises one or more optical lenses and an electrochromic layer positioned between the one or more optical lenses and the sensor array. The electrochromic layer has one or more optical properties that are responsive to voltage applied to the layer, including a first optical property related to optical transmissivity. The first optical property includes a first state, responsive to a first applied voltage, in which the layer is substantially opaque to a predefined band of IR wavelengths. The first optical property also includes a second state, responsive to a second applied voltage distinct from the first applied voltage, in which the layer is substantially transparent to the predefined band of IR wavelengths and visible wavelengths.

Abstract: The various implementations described herein include systems and devices that comprise a cooling structure. In one aspect, a camera system comprises a cooling structure made from a thermally conductive material. The cooling structure has an exterior surface, an interior surface, a hollow portion, and a sidewall. The sidewall includes a through hole that penetrates the sidewall. The exterior surface includes surface features and is configured to radiate away from the cooling structure heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface. The camera system further comprises a camera contained within the hollow portion of the cooling structure, a first electrical component that is embedded in the through hole, electrical components contained within the hollow portion, and an external housing that at least partially encloses the cooling structure.

Abstract: This application discloses a stand assembly that includes a receiving element for physically receiving a module, and a base assembly for supporting the receiving element. The receiving element further includes a module holding structure, an extended portion, and a first fastener structure coupled to an end of the extended portion. The base assembly includes a base, and a second fastener structure coupled to the base at a joint and configured to mate with the first fastener structure. The first fastener structure and the joint are configured to respectively provide a first degree of freedom of motion and a second degree of freedom of motion of the receiving element with respect to the base. The movement of the receiving element at the first degree of freedom has substantially consistent resistance through first part of a first full range of motion associated with the first degree of freedom of motion.

Abstract: A stand assembly for an electronic device includes a neck portion with a first end that holds and extends from the electronic device, a spine portion that is coupled via a joint structure to a second end of the neck portion, the joint structure being configured to provide a first rotational degree of freedom of the neck portion with respect to the spine portion, and one or more interconnect wires. The one or more interconnect wires include a first wire portion, a second wire portion and a third wire portion, the first wire portion being routed through an interior of the neck portion, the second wire portion being routed along a surface of the spine portion, and the third wire portion being routed though the joint structure from the surface of the spine portion to the interior of the neck portion.

Abstract: A stand assembly for an electronic device includes a neck portion with a first end that holds and extends from the electronic device, a spine portion that is coupled via a joint structure to a second end of the neck portion, the joint structure being configured to provide a first rotational degree of freedom of the neck portion with respect to the spine portion, and one or more interconnect wires. The one or more interconnect wires include a first wire portion, a second wire portion and a third wire portion, the first wire portion being routed through an interior of the neck portion, the second wire portion being routed along a surface of the spine portion, and the third wire portion being routed though the joint structure from the surface of the spine portion to the interior of the neck portion.

Abstract: This application discloses a stand assembly that includes an upper portion for holding electronic components and a lower portion for supporting the upper portion. The lower portion including a base, a joint, and a second fastener structure configured to mate with a first fastener structure of the upper portion. The first fastener structure and the joint are configured to respectively provide a first degree of freedom of motion and a second degree of freedom of motion of the upper portion with respect to the lower portion. Movement of the upper portion at the first degree of freedom has substantially consistent resistance through first part of a first full range of motion associated with the first degree of freedom of motion. Movement of the upper portion at the second degree of freedom has substantially consistent resistance through a second full range of motion associated with the second degree of freedom.