Abstract: A coated substrate comprising a coating extending over at least a part of the substrate. The coating is obtainable from a coating composition comprising (a) a polymeric binder; and (b) a feathering reducing agent comprising a carboxylic acid reactive functional group. The coated portion of the substrate comprises a pretreatment layer. The pretreatment layer is obtainable from a pretreatment composition that comprises a trivalent chromium compound. The invention extends to a method of coating a pre-treated substrate and a coated package, such as a metal can.

Abstract: There is provided a semiconductor device 1, comprising: a housing comprising: a first housing electrode 4 and a second housing electrode 5 arranged at opposite sides of the housing, and a tubular housing element 8 arranged between the first and second housing electrodes 4, 5 and configured to electrically isolate the first and second housing electrodes 4, 5 from one another; at least one semiconductor chip 20 arranged within the housing between the first and second housing electrodes 4, 5; and a metal explosion shield 12 arranged within the housing, wherein the metal explosion shield 12 is configured to extend into a space formed between the at least one semiconductor chip 20 and the tubular housing element 8 such that the metal explosion shield surrounds the at least one semiconductor chip 20.

Abstract: The present disclosure provides a semiconductor device 1, comprising: a housing comprising an internal space; at least one semiconductor chip 20 arranged inside the housing; and a separator 13 arranged inside the housing and configured to separate the internal space of the housing into a first chamber 11 and a second chamber 12, wherein the at least one semiconductor chip 20 is arranged within the first chamber 11; wherein the separator 13 comprises a deformable portion 15, and the deformable portion 15 is configured to deform when a pressure difference between the first and second chambers 11, 12 exceeds a threshold differential pressure or a temperature at the deformable portion 15 exceeds a threshold temperature, so as to transform the first chamber 11 from a hermetically sealed chamber to an open chamber in fluid communication with the second chamber 12.

Abstract: A coating composition comprising (a) a polyester binder material; and (b) a feathering reducing agent. The feathering reducing agent is selected from (i) an acrylic feathering reducing agent comprising a functional group selected from hydroxyl, epoxide, phosphatized epoxide and/or acid-functional; (ii) a hydroxy-functional polyester feathering reducing agent; (iii) a feathering reducing agent comprising a functional group selected from amine, amide, imine and/or nitrile; (iv) a phosphatized epoxy feathering reducing agent; (v) a phenolic resin feathering reducing agent; and/or (vi) a feathering reducing agent comprising an oxazolyl functional group. The invention extends to a substrate coated with the coating composition and use of the coating composition to reduce feathering.

Abstract: Various embodiments of the present disclosure are directed towards free-piston combustion engines. As described herein, a driver section may be provided in a free-piston combustion engine for storing energy during an expansion stroke. The driver section may be configured to store sufficient energy to perform the subsequent stroke. In some embodiments, the driver section may be configured to store sufficient energy so as to enable the engine to operate continuously across engine cycles without electrical energy input. A linear electromagnetic machine may be provided in a free-piston combustion engine for converting the kinetic energy of a piston assembly into electrical energy.

Abstract: There is provided a semiconductor device 1, comprising: a housing comprising a housing electrode 4; and at least one semiconductor chip 20 arranged within the housing; wherein the housing electrode 4 comprises a deformable portion 15, and the deformable portion 15 is configured to deform when a pressure difference between an interior and an exterior of the housing exceeds a threshold differential pressure or a temperature at the deformable portion exceeds a threshold temperature, so as to transform the housing from a hermetically sealed housing to an open housing in fluid communication with the exterior.

Abstract: There is provided a semiconductor device 1, comprising: a housing comprising a first housing electrode 4 and a second housing electrode 5 arranged at opposite sides of the housing; and a plurality of semiconductor units 30 arranged within the housing between the first and second housing electrodes 4, 5 and coupled to at least one of the first and second housing electrodes 4, 5 by pressure, wherein the plurality of semiconductor units 30 comprise a first semiconductor unit 30-1 and a second semiconductor unit 30-2 neighbouring the first semiconductor unit 30-1; wherein the first and/or second housing electrode comprises a plurality of pillars 10, and the plurality of pillars comprise a first pillar 10-1 and a second pillar 10-2 electrically coupled to the first and second semiconductor units 30-1, 30-2, respectively, and wherein a surface 16 of the first housing electrode 4 comprises a groove 15, and a width W1 of the groove 15 is less than a spacing S2 between the first pillar 10-1 and the second pillar 10-2.

Abstract: There is provided a semiconductor device 100, comprising: at least one semiconductor chip 5, and a structure 2 thermally coupled to the at least one semiconductor chip 5, wherein the structure 2 comprises a surface located within an interior of the semiconductor device, and the surface comprises a groove 12; and a sensor 16 comprising an optical fibre 13 passing through the groove 12, wherein the sensor 16 is configured to sense a temperature of the at least one semiconductor chip 5.

Abstract: Various embodiments of the present disclosure are directed towards free-piston combustion engines. As described herein, a driver section may be provided in a free-piston combustion engine for storing energy during an expansion stroke. The driver section may be configured to store sufficient energy to perform the subsequent stroke. In some embodiments, the driver section may be configured to store sufficient energy so as to enable the engine to operate continuously across engine cycles without electrical energy input. A linear electromagnetic machine may be provided in a free-piston combustion engine for converting the kinetic energy of a piston assembly into electrical energy.

Abstract: Various embodiments of the present invention are directed toward a linear combustion engine, comprising: a cylinder having a cylinder wall and a pair of ends, the cylinder including a combustion section disposed in a center portion of the cylinder; a pair of opposed piston assemblies adapted to move linearly within the cylinder, each piston assembly disposed on one side of the combustion section opposite the other piston assembly, each piston assembly including a spring rod and a piston comprising a solid front section adjacent the combustion section and a gas section; and a pair of linear electromagnetic machines adapted to directly convert kinetic energy of the piston assembly into electrical energy, and adapted to directly convert electrical energy into kinetic energy of the piston assembly for providing compression work during the compression stroke.

Abstract: Various embodiments of the present disclosure are directed towards free-piston combustion engines. As described herein, a driver section may be provided in a free-piston combustion engine for storing energy during an expansion stroke. The driver section may be configured to store sufficient energy to perform the subsequent stroke. In some embodiments, the driver section may be configured to store sufficient energy so as to enable the engine to operate continuously across engine cycles without electrical energy input. A linear electromagnetic machine may be provided in a free-piston combustion engine for converting the kinetic energy of a piston assembly into electrical energy.

Abstract: We disclose herein a semiconductor device sub-assembly comprising a plurality of semiconductor units of a first type, a plurality of semiconductor units of a second type; a plurality of conductive blocks operatively coupled with the plurality of semiconductor units, a conductive malleable layer operatively coupled with the plurality of conductive blocks, wherein the plurality of conductive blocks are located between the conductive malleable layer and the plurality of semiconductor units. In use, at least some of the plurality of conductive blocks are configured to apply a pressure on the conductive malleable layer, when a predetermined pressure is applied to the semiconductor device sub-assembly. At least one semiconductor unit of a second type is configured to withstand an applied pressure greater than a threshold pressure.

Abstract: Various embodiments of the present invention are directed toward a linear combustion engine, comprising: a cylinder having a cylinder wall and a pair of ends, the cylinder including a combustion section disposed in a center portion of the cylinder; a pair of opposed piston assemblies adapted to move linearly within the cylinder, each piston assembly disposed on one side of the combustion section opposite the other piston assembly, each piston assembly including a spring rod and a piston comprising a solid front section adjacent the combustion section and a gas section; and a pair of linear electromagnetic machines adapted to directly convert kinetic energy of the piston assembly into electrical energy, and adapted to directly convert electrical energy into kinetic energy of the piston assembly for providing compression work during the compression stroke.

Abstract: Various embodiments of the present disclosure are directed towards free-piston combustion engines. As described herein, a driver section may be provided in a free-piston combustion engine for storing energy during an expansion stroke. The driver section may be configured to store sufficient energy to perform the subsequent stroke. In some embodiments, the driver section may be configured to store sufficient energy so as to enable the engine to operate continuously across engine cycles without electrical energy input. A linear electromagnetic machine may be provided in a free-piston combustion engine for converting the kinetic energy of a piston assembly into electrical energy.

Abstract: Various embodiments of the present disclosure are directed towards free-piston combustion engines. As described herein, a driver section may be provided in a free-piston combustion engine for storing energy during an expansion stroke. The driver section may be configured to store sufficient energy to perform the subsequent stroke. In some embodiments, the driver section may be configured to store sufficient energy so as to enable the engine to operate continuously across engine cycles without electrical energy input. A linear electromagnetic machine may be provided in a free-piston combustion engine for converting the kinetic energy of a piston assembly into electrical energy.

Abstract: A network node adapted to forward incoming data packets, the network node including a tag identifying unit, adapted to identify a tag of an incoming data packet as a replicate tag; a tag look-up module, adapted to retrieve from a tag table a number of replications and destinations for the replicate tag; a replicating engine, configured to replicate the incoming data packet according to the number of replications, thereby generating replicated data packets; and a forwarding unit, adapted to forward the replicated data packets to the destinations.

Abstract: We disclose herein a semiconductor device sub-assembly comprising: a plurality of semiconductor units laterally spaced to one another; a semiconductor unit locator comprising a plurality of holes, wherein each semiconductor unit is located in each hole of the semiconductor unit locator; a plurality of pressure means for applying pressure to each semiconductor unit, and a conductive malleable layer located between the plurality of pressure means and the semiconductor unit locator.

Abstract: We disclose herein a semiconductor device sub-assembly comprising a plurality of semiconductor units of a first type, a plurality of semiconductor units of a second type; a plurality of conductive blocks operatively coupled with the plurality of semiconductor units, a conductive malleable layer operatively coupled with the plurality of conductive blocks, wherein the plurality of conductive blocks are located between the conductive malleable layer and the plurality of semiconductor units. In use, at least some of the plurality of conductive blocks are configured to apply a pressure on the conductive malleable layer, when a predetermined pressure is applied to the semiconductor device sub-assembly. At least one semiconductor unit of a second type is configured to withstand an applied pressure greater than a threshold pressure.

Abstract: Embodiments herein are directed to topical compositions comprising a therapeutically effective amount of methyl N-[3-(6,7-dimethoxy-2-methylaminoquinazolin-4-yl)phenyl]terephthalamic acid, PEG 400, PEG 4000, white petrolatum, vitamin E, glycerol monostearate/glycerides, isopropyl myristate, and water. The topical compositions may be used to treat a variety of skin conditions, including atopic dermatitis. Patients treated include pediatrics, adolescents and adults.

Abstract: Various embodiments of the present invention are directed toward a linear combustion engine, comprising: a cylinder having a cylinder wall and a pair of ends, the cylinder including a combustion section disposed in a center portion of the cylinder; a pair of opposed piston assemblies adapted to move linearly within the cylinder, each piston assembly disposed on one side of the combustion section opposite the other piston assembly, each piston assembly including a spring rod and a piston comprising a solid front section adjacent the combustion section and a gas section; and a pair of linear electromagnetic machines adapted to directly convert kinetic energy of the piston assembly into electrical energy, and adapted to directly convert electrical energy into kinetic energy of the piston assembly for providing compression work during the compression stroke.