Abstract: Apparatus, systems and methods for alignment of a glass member for high temperature processing are disclosed. The high temperature processing can, for example, pertain to a slumping process to mold glass into a predetermined shape (e.g., a three-dimensional shape). In one embodiment, a glass slumping system can have a mold and an alignment system that support a glass member to be slumped relative to the mold. The alignment system may have a plurality of alignment members being configured to move away from the glass member as the temperature increases during the slumping process to allow the glass member to bend around the mold without interference.

Abstract: Apparatus, systems and methods for alignment of a glass member for high temperature processing are disclosed. The high temperature processing can, for example, pertain to a slumping process to mold glass into a predetermined shape (e.g., a three-dimensional shape). In one embodiment, a glass slumping system can have a mold and an alignment system that support a glass member to be slumped relative to the mold. The alignment system may have a plurality of alignment members being configured to move away from the glass member as the temperature increases during the slumping process to allow the glass member to bend around the mold without interference.

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Abstract: Apparatus, systems and methods for alignment of a glass member for high temperature processing are disclosed. The high temperature processing can, for example, pertain to a slumping process to mold glass into a predetermined shape (e.g., a three-dimensional shape). In one embodiment, a glass slumping system can have a mold and an alignment system that support a glass member to be slumped relative to the mold. The alignment system may have a plurality of alignment members being configured to move away from the glass member as the temperature increases during the slumping process to allow the glass member to bend around the mold without interference.

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Abstract: Apparatus, systems and methods for alignment of a glass member for high temperature processing are disclosed. The high temperature processing can, for example, pertain to a slumping process to mold glass into a predetermined shape (e.g., a three-dimensional shape). In one embodiment, a glass slumping system can have a mold and an alignment system that support a glass member to be slumped relative to the mold. The alignment system may have a plurality of alignment members being configured to move away from the glass member as the temperature increases during the slumping process to allow the glass member to bend around the mold without interference.