Patents by Inventor Adam Well

Adam Well has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9162341
    Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: October 20, 2015
    Assignee: FNS TECH CO., LTD
    Inventors: Paul LeFevre, Anoop Mathew, Scott Xin Qiao, Guangwei Wu, David Adam Wells, Oscar K. Hsu
  • Patent number: 8900036
    Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: December 2, 2014
    Assignee: FNS Tech No., Ltd.
    Inventors: Oscar K. Hsu, Marc C. Jin, David Adam Wells, John Erik Aldeborgh
  • Patent number: 8790165
    Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: July 29, 2014
    Assignee: FNS Tech Co., Ltd.
    Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Xuechan Zhao
  • Patent number: 8758659
    Abstract: A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)?(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: June 24, 2014
    Assignee: FNS Tech Co., Ltd.
    Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Guangwei Wu, Anoop Mathew
  • Publication number: 20140115854
    Abstract: Methods for aircraft component repair and reclamation are provided. Cold spraying aircraft panels include identifying a fastener hole in an aircraft panel in need of repair, capturing the location of the fastener hole, and depositing cold spray material about the fastener hole for reclaiming the aircraft panel. Any excess material may be removed. Cold spraying hydraulic lines includes identifying a surface of the hydraulic line in need of repair, aiming a cold spray nozzle at the surface of the hydraulic line and depositing a cold spray material on the surface of the hydraulic line. Excess cold spray material may be removed as needed.
    Type: Application
    Filed: October 29, 2013
    Publication date: May 1, 2014
    Inventors: Christian Widener, Adam Well, Owen Britton, Brian James, Rob Hrabe, Victor Champagne
  • Patent number: 8684794
    Abstract: A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing at least a portion of the elements from the polishing pad forming void spaces within the polishing pad by one of a chemical method or mechanical method, prior to use in chemical/mechanical planarization procedures.
    Type: Grant
    Filed: August 4, 2008
    Date of Patent: April 1, 2014
    Assignee: FNS Tech Co., Ltd.
    Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, Scott Xin Qiao, Anoop Mathew, Guangwei Wu
  • Patent number: 8491360
    Abstract: The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: July 23, 2013
    Assignee: Innopad, Inc.
    Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, Marc C. Jin, John Erik Aldeborgh
  • Patent number: 8435099
    Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: May 7, 2013
    Assignee: Innopad, Inc.
    Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, David Adam Wells, Oscar K. Hsu, Xuechan Zhao
  • Patent number: 8430721
    Abstract: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: April 30, 2013
    Assignee: Innopad, Inc.
    Inventors: Oscar K. Hsu, Paul Lefevre, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
  • Patent number: 8377351
    Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: February 19, 2013
    Assignee: Innopad, Inc.
    Inventors: Paul Lefevre, David Adam Wells, Marc C. Jin, Oscar K. Hsu, John Erik Aldeborgh, Scott Xin Qiao, Anoop Mathew, Guangwei Wu
  • Patent number: 8172648
    Abstract: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: May 8, 2012
    Assignee: Innopad, Inc.
    Inventors: Paul Lefevre, Oscar K. Hsu, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
  • Patent number: 8137166
    Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.
    Type: Grant
    Filed: July 19, 2007
    Date of Patent: March 20, 2012
    Assignee: Innopad, Inc.
    Inventors: Oscar K. Hsu, Marc C. Jin, David Adam Wells, John Erik Aldeborgh
  • Patent number: 7985121
    Abstract: A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: July 26, 2011
    Assignee: Innopad, Inc.
    Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin
  • Publication number: 20090170410
    Abstract: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.
    Type: Application
    Filed: December 31, 2008
    Publication date: July 2, 2009
    Applicant: INNOPAD, INC.
    Inventors: Oscar K. Hsu, Paul Lefevre, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
  • Publication number: 20090170413
    Abstract: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
    Type: Application
    Filed: December 31, 2008
    Publication date: July 2, 2009
    Applicant: innoPad, Inc.
    Inventors: Oscar K. Hsu, Paul Lefevre, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
  • Publication number: 20090137121
    Abstract: The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.
    Type: Application
    Filed: October 23, 2008
    Publication date: May 28, 2009
    Applicant: innoPad, Inc.
    Inventors: Oscar K. HSU, Paul Lefevre, David Adam Wells, Marc C. Jin, John Erik Aldeborgh
  • Publication number: 20070080566
    Abstract: A passenger seat assembly for a vehicle, particularly an aircraft, which is adapted to provide self-contained, individual seating and sleeping accommodation for a passenger, said seating assembly including a supporting structure (42) for supporting said assembly off the floor of a vehicle; one or more movable, passenger-bearing, structural components (71, 72); and means for connecting said movable, structural components to said structure such that said components can be selectively moved between a seat configuration, in which a plurality of passenger-bearing surfaces on said one or more structural, movable components (71, 71) or said supporting structure form a seat for the passenger, and a bed configuration, in which a plurality of said bearing surfaces (47, 48, 67, 74, 76) are disposed substantially coplanarly and substantially contiguously to form a bed for the passenger; characterized in that at least one of said movable components (72) is double-sided, comprising first and second opposite sides, one of s
    Type: Application
    Filed: March 31, 2006
    Publication date: April 12, 2007
    Inventors: David Ferry, Adam Wells, Luke Miles, Andrew Lawler, David Starkey, Simon-Frederick Mills, Gary Doy
  • Publication number: 20070069073
    Abstract: A passenger seat assembly for a vehicle, particularly an aircraft, which is adapted to provide self-contained, individual seating and sleeping accommodation for a passenger, said seating assembly includes a supporting structure (42) for supporting said assembly off the floor of a vehicle; one or more movable, passenger-bearing, structural components (71,72); and means for connecting said movable, structural components to said structure such that said components can be selectively moved between a seat configuration, in which a plurality of passenger-bearing surfaces on said one or more structural, movable components (71,71) or said supporting structure form a seat for the passenger, and a bed configuration, in which a plurality of said bearing surfaces (47,48,67,74,76) are disposed substantially coplanarly and substantially contiguously to form a bed for the passenger; characterized in that at least one of said movable components (72) is double-sided, comprising first and second opposite sides, one of said sid
    Type: Application
    Filed: March 31, 2006
    Publication date: March 29, 2007
    Inventors: David Ferry, Adam Wells, Luke Miles, Andrew Lawler, David Starkey, Simon Mills, Gary Doy
  • Publication number: 20050012363
    Abstract: A passenger accommodation cabin (15) for a vehicle, particularly an aircraft, which comprises: wall means (12, 14, 16) defining a passenger accommodation area; plinth means (10) disposed substantially at floor level and adapted to support mattress means (25) within said accommodation area to provide at least one substantially flat bed; false floor means (42) that are selectively movable between a deployed position in which said false floor means at least partially cover the mattress means and a retracted position for allowing use of said bed; and seating means (30) comprising at least one seat and associated supporting structure for supporting said seat within the accommodation area generally above the mattress means.
    Type: Application
    Filed: August 9, 2002
    Publication date: January 20, 2005
    Inventors: David Ferry, Adam Wells, Luke Miles
  • Patent number: D583579
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: December 30, 2008
    Assignee: Virgin Atlantic Airways Limited
    Inventors: Luke Pearson, Tom Lloyd, David Ferry, Adam Wells, Luke Miles