Patents by Inventor Adam Zbrzezny

Adam Zbrzezny has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die substrate with reinforcement structure
    Patent number: 8927344
    Abstract: Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate.
    Type: Grant
    Filed: November 8, 2012
    Date of Patent: January 6, 2015
    Assignee: ATI Technologies ULC
    Inventors: Roden Topacio, Adam Zbrzezny
  • Wafer level packaging of semiconductor chips
    Patent number: 8785317
    Abstract: A method of manufacturing semiconductor packages at the wafer level is disclosed. A wafer has multiple integrated circuits (ICs) formed on its active surface, with each IC in communication with a plurality under-bump metallization (UBM) pads formed on one surface the package. The UBM pads include a larger pads near the center of package and smaller UBM pads near the periphery. The method includes attaching a stiffener to an inactive surface of the wafer; forming under bump metallization pads; and forming solder bumps extending from the UBM pads.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: July 22, 2014
    Assignee: ATI Technologies ULC
    Inventors: Neil Mclellan, Adam Zbrzezny
  • DIE SUBSTRATE WITH REINFORCEMENT STRUCTURE
    Publication number: 20130069250
    Abstract: Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate.
    Type: Application
    Filed: November 8, 2012
    Publication date: March 21, 2013
    Inventors: Roden Topacio, Adam Zbrzezny
  • Wafer level packaging of semiconductor chips
    Patent number: 8344505
    Abstract: A method of manufacturing semiconductor packages at the wafer level is disclosed. A wafer has multiple integrated circuits (ICs) formed on its active surface, with each IC in communication with a plurality under-bump metallization (UBM) pads formed on one surface the package. The UBM pads include a larger pads near the center of package and smaller UBM pads near the periphery. The method includes attaching a stiffener to an inactive surface of the wafer; forming under bump metallization pads; and forming solder bumps extending from the UBM pads.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: January 1, 2013
    Assignee: ATI Technologies ULC
    Inventors: Neil Mclellan, Adam Zbrzezny
  • Die substrate with reinforcement structure
    Patent number: 8313984
    Abstract: Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: November 20, 2012
    Assignee: ATI Technologies ULC
    Inventors: Roden Topacio, Adam Zbrzezny
  • Die substrate with reinforcement structure
    Publication number: 20090236730
    Abstract: Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate.
    Type: Application
    Filed: March 19, 2008
    Publication date: September 24, 2009
    Inventors: Roden Topacio, Adam Zbrzezny
  • WAFER LEVEL PACKAGING OF SEMICONDUCTOR CHIPS
    Publication number: 20090057887
    Abstract: A method of manufacturing semiconductor packages at the wafer level is disclosed. A wafer has multiple integrated circuits (ICs) formed on its active surface, with each IC in communication with a plurality under-bump metallization (UBM) pads formed on one surface the package. The UBM pads include a larger pads near the center of package and smaller UBM pads near the periphery. The method includes attaching a stiffener to an inactive surface of the wafer; forming under bump metallization pads; and forming solder bumps extending from the UBM pads.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 5, 2009
    Applicant: ATI Technologies ULC
    Inventors: Neil Mclellan, Adam Zbrzezny