Abstract: Described herein are systems for automated docking of an unmanned aerial vehicle. For example, some systems include an unmanned aerial vehicle including a propulsion mechanism, a battery, and a processing apparatus; and a dock including a landing surface with a funnel geometry shaped to fit a bottom surface of the unmanned aerial vehicle at a base of the funnel, wherein tapered sides of the funnel form corners at the base of the funnel, and a battery charger configured to charge the battery of the unmanned aerial vehicle while the unmanned aerial vehicle is on the landing surface, wherein conducting contacts of the battery charger are on the landing surface, positioned at the bottom of the funnel.

Abstract: A method of applying a dielectric coating on a structure array of a component of an electrical device includes applying a first layer of a first dielectric material on a structure array with an atomic layer deposition (ALD) process. The structure array is formed on a substrate and has a plurality of features, each of the plurality of features having an aspect ratio of at least 1:1.

Abstract: The present invention provides engineered acid alpha-glucosidase (GAA) polypeptides and compositions thereof. In some embodiments, the engineered GAA polypeptides have been optimized to provide increased expression, stability at neutral pH, and activity in cell lysates. The invention also provides methods for utilization of the compositions comprising the engineered GAA polypeptides for therapeutic and other purposes.

Abstract: Described herein are systems for roof scan using an unmanned aerial vehicle. For example, some methods include capturing, using an unmanned aerial vehicle, an overview image of a roof of a building from above the roof; presenting a suggested bounding polygon overlaid on the overview image to a user; determining a bounding polygon based on the suggested bounding polygon and user edits; based on the bounding polygon, determining a flight path including a sequence of poses of the unmanned aerial vehicle with respective fields of view at a fixed height that collectively cover the bounding polygon; fly the unmanned aerial vehicle to a sequence of scan poses with horizontal positions matching respective poses of the flight path and vertical positions determined to maintain a consistent distance above the roof; and scanning the roof from the sequence of scan poses to generate a three-dimensional map of the roof.

Abstract: In some examples, an unmanned aerial vehicle (UAV) may include one or more processors configured to capture, with one or more image sensors, and while the UAV is in flight, a plurality of images of a target. The one or more processors may compare a first image of the plurality of images with a second image of the plurality of images to determine a difference between a current frame of reference position for the UAV and an estimate of an actual frame of reference position for the UAV. In addition, the one or more processors may determine, based at least on the difference, and while the UAV is in flight, an update to a three-dimensional model of the target.

Abstract: The present invention discloses compounds of Formula (I), or pharmaceutically acceptable salts, esters, or prodrugs thereof: which inhibit Respiratory Syncytial Virus (RSV). The present invention further relates to pharmaceutical compositions comprising the aforementioned compounds for administration to a subject suffering from RSV infection. The invention also relates to methods of treating an RSV infection in a subject by administering a pharmaceutical composition comprising the compounds of the present invention.

Abstract: The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a leadframe having leads with a nickel plating. To form the bump bond between a fine aluminum wire, such as a 2 mil diameter wire, and the lead, an aluminum bump is bonded to the nickel plating and the wire is bonded to the bump. The bump is aluminum doped with nickel and is formed from a large diameter wire, such as a 6 mil diameter wire.

Abstract: A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.

Abstract: The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a leadframe having leads with a nickel plating. To form the bump bond between a fine aluminum wire, such as a 2 mil diameter wire, and the lead, an aluminum bump is bonded to the nickel plating and the wire is bonded to the bump. The bump is aluminum doped with nickel and is formed from a large diameter wire, such as a 6 mil diameter wire.

Abstract: A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.

Abstract: The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a leadframe having leads with a nickel plating. To form the bump bond between a fine aluminum wire, such as a 2 mil diameter wire, and the lead, an aluminum bump is bonded to the nickel plating and the wire is bonded to the bump. The bump is aluminum doped with nickel and is formed from a large diameter wire, such as a 6 mil diameter wire.