Patents by Inventor Adarsh Karan JAISWAL

Adarsh Karan JAISWAL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEVICES AND METHODS RELATED TO STACK ASSEMBLY
    Publication number: 20240114794
    Abstract: Devices and methods related to stack assembly. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 4, 2024
    Inventors: Hardik Bhupendra MODI, Adarsh Karan JAISWAL, Anil K. AGARWAL, Engin Ibrahim PEHLIVANOGLU
  • Stack assembly for radio-frequency applications
    Patent number: 11785853
    Abstract: Stack assembly for radio-frequency applications. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.
    Type: Grant
    Filed: June 13, 2021
    Date of Patent: October 10, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hardik Bhupendra Modi, Adarsh Karan Jaiswal, Anil K. Agarwal, Engin Ibrahim Pehlivanoglu
  • STACK ASSEMBLY FOR RADIO-FREQUENCY APPLICATIONS
    Publication number: 20210376224
    Abstract: Stack assembly for radio-frequency applications. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.
    Type: Application
    Filed: June 13, 2021
    Publication date: December 2, 2021
    Inventors: Hardik Bhupendra MODI, Adarsh Karan JAISWAL, Anil K. AGARWAL, Engin Ibrahim PEHLIVANOGLU
  • Stack assembly having electro-acoustic device
    Patent number: 11038096
    Abstract: Stack assembly having electro-acoustic device. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: June 15, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hardik Bhupendra Modi, Adarsh Karan Jaiswal, Anil K. Agarwal, Engin Ibrahim Pehlivanoglu
  • STACK ASSEMBLY HAVING ELECTRO-ACOUSTIC DEVICE
    Publication number: 20190115309
    Abstract: Stack assembly having electro-acoustic device. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.
    Type: Application
    Filed: October 15, 2018
    Publication date: April 18, 2019
    Inventors: Hardik Bhupendra MODI, Adarsh Karan JAISWAL, Anil K. AGARWAL, Engin Ibrahim PEHLIVANOGLU