Patents by Inventor Adel Eisherbini

Adel Eisherbini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL MANAGEMENT SOLUTIONS FOR EMBEDDED INTEGRATED CIRCUIT DEVICES
    Publication number: 20200083135
    Abstract: An integrated circuit structure may be formed having a substrate, at least one integrated circuit device embedded in and electrically attached to the substrate, and a heat dissipation device in thermal contact with the integrated circuit device, wherein a first portion of the heat dissipation device extends into the substrate and wherein a second portion of the heat dissipation device extends over the substrate. In one embodiment, the heat dissipation device may comprise the first portion of the heat dissipation device formed from metallization within the substrate.
    Type: Application
    Filed: September 12, 2018
    Publication date: March 12, 2020
    Applicant: Intel Corporation
    Inventors: Johanna Swan, Feras Eid, Adel Eisherbini