Patents by Inventor Adi Irwan Herman

Adi Irwan Herman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device with step cut lead
    Patent number: 11502045
    Abstract: An electronic device includes a semiconductor die, an enclosure, leads extending outwardly from the enclosure and electrically connected to the semiconductor die, and wherein the leads have a reduced cross-sectional area along a longitudinal length of the lead. The electronic device is designed to reduce the occurrence of crack formation between the leads and a printed circuit board.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: November 15, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Amirul Afiq bin Hud, Wei Fen Sueann Lim, Adi Irwan Herman
  • Real time chuck temperature monitoring
    Patent number: 11435398
    Abstract: A wafer probe test system includes a chuck to support a wafer, and a probe card having a first side to face the chuck, an opposite second side, and an aperture that extends between the first and second sides. The system also includes a probe head mounted to the first side of the probe card and having probe pins to contact a device under test of the wafer, and an infra-red thermal sensor facing the aperture of the probe card to sense a temperature of the wafer.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: September 6, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Guan Da Lee, Adi Irwan Herman
  • REAL TIME CHUCK TEMPERATURE MONITORING
    Publication number: 20220178993
    Abstract: A wafer probe test system includes a chuck to support a wafer, and a probe card having a first side to face the chuck, an opposite second side, and an aperture that extends between the first and second sides. The system also includes a probe head mounted to the first side of the probe card and having probe pins to contact a device under test of the wafer, and an infra-red thermal sensor facing the aperture of the probe card to sense a temperature of the wafer.
    Type: Application
    Filed: December 7, 2020
    Publication date: June 9, 2022
    Inventors: Guan Da Lee, Adi Irwan Herman
  • ELECTRONIC DEVICE WITH STEP CUT LEAD
    Publication number: 20200235057
    Abstract: An electronic device includes a semiconductor die, an enclosure, leads extending outwardly from the enclosure and electrically connected to the semiconductor die, and wherein the leads have a reduced cross-sectional area along a longitudinal length of the lead. The electronic device is designed to reduce the occurrence of crack formation between the leads and a printed circuit board.
    Type: Application
    Filed: January 23, 2019
    Publication date: July 23, 2020
    Applicant: Texas Instruments Incorporated
    Inventors: Amirul Afiq bin Hud, Wei Fen Sueann Lim, Adi Irwan Herman