Patents by Inventor Adinath Shantinath Narasgond

Adinath Shantinath Narasgond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid under-bump metallization component
    Patent number: 11749605
    Abstract: Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device can comprise an under-bump metallization component that can comprise a superconducting interconnect component and a solder wetting component. The device can further comprise a solder bump that can be coupled to the superconducting interconnect component and the solder wetting component. In some embodiments, the superconducting interconnect component can comprise a hermetically sealed superconducting interconnect component.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: September 5, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jae-Woong Nah, Eric Peter Lewandowski, Adinath Shantinath Narasgond
  • Sandwich-parallel micro-battery
    Patent number: 11043690
    Abstract: Systems and/or techniques associated with a sandwich-parallel micro-battery are provided. In one example, a device comprises a first battery and a second battery. The first battery comprises a first surface and a second surface. The second surface is smaller than the first surface. The second battery comprises a third surface and a fourth surface. The fourth surface is smaller than the third surface. Furthermore, the fourth surface is mechanically coupled to the second surface of the first battery. The third surface of the second battery and the first surface of the first battery comprise a conductive contact that electrically couples the first battery and the second battery.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: June 22, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jae-Woong Nah, Paul S. Andry, Eric Peter Lewandowski, Bucknell C. Webb, Adinath Shantinath Narasgond, Bo Wen
  • HYBRID UNDER-BUMP METALLIZATION COMPONENT
    Publication number: 20210118808
    Abstract: Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device can comprise an under-bump metallization component that can comprise a superconducting interconnect component and a solder wetting component. The device can further comprise a solder bump that can be coupled to the superconducting interconnect component and the solder wetting component. In some embodiments, the superconducting interconnect component can comprise a hermetically sealed superconducting interconnect component.
    Type: Application
    Filed: December 9, 2020
    Publication date: April 22, 2021
    Inventors: Jae-Woong Nah, Eric Peter Lewandowski, Adinath Shantinath Narasgond
  • Hybrid under-bump metallization component
    Patent number: 10937735
    Abstract: Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device can comprise an under-bump metallization component that can comprise a superconducting interconnect component and a solder wetting component. The device can further comprise a solder bump that can be coupled to the superconducting interconnect component and the solder wetting component. In some embodiments, the superconducting interconnect component can comprise a hermetically sealed superconducting interconnect component.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: March 2, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jae-Woong Nah, Eric Peter Lewandowski, Adinath Shantinath Narasgond
  • SANDWICH-PARALLEL MICRO-BATTERY
    Publication number: 20200212475
    Abstract: Systems and/or techniques associated with a sandwich-parallel micro-battery are provided. In one example, a device comprises a first battery and a second battery. The first battery comprises a first surface and a second surface. The second surface is smaller than the first surface. The second battery comprises a third surface and a fourth surface. The fourth surface is smaller than the third surface. Furthermore, the fourth surface is mechanically coupled to the second surface of the first battery. The third surface of the second battery and the first surface of the first battery comprise a conductive contact that electrically couples the first battery and the second battery.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 2, 2020
    Inventors: Jae-Woong Nah, Paul S. Andry, Eric Peter Lewandowski, Bucknell C. Webb, Adinath Shantinath Narasgond, Bo Wen
  • HYBRID UNDER-BUMP METALLIZATION COMPONENT
    Publication number: 20200098695
    Abstract: Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device can comprise an under-bump metallization component that can comprise a superconducting interconnect component and a solder wetting component. The device can further comprise a solder bump that can be coupled to the superconducting interconnect component and the solder wetting component. In some embodiments, the superconducting interconnect component can comprise a hermetically sealed superconducting interconnect component.
    Type: Application
    Filed: September 20, 2018
    Publication date: March 26, 2020
    Inventors: Jae-Woong Nah, Eric Peter Lewandowski, Adinath Shantinath Narasgond