Abstract: Devices and methods for releasing an integrated circuit from its container are provided. The devices include a handle portion and a gripping portion. The gripping portion has one or more notches that are used to engage an integrated circuit container pin. In one aspect, the gripping portion is used to engage the container pin, and downward pressure is applied to the handle portion to remove the pin. In another aspect, the gripping portion is used to engage the container pin, and the handle portion is twisted to remove the pin.

Abstract: The invention provides a device, a dambar punch setup jig, which permits dambar punches to be rapidly installed in a dambar punch housing. The dambar punches are placed on the dambar punch setup jig, where their positions are fixed relative to one another. The dambar punches may be held in place on the dambar punch setup jig by a cover. Once installed in the dambar punch setup jig, the dambar punches can be simultaneously installed in the dambar punch housing. The dambar punch setup jig may then be removed, leaving the dambar punches installed in the dambar punch housing. The dambar punches are easier to install in the dambar punch setup jig then in the dambar punch housing, saving operator time. Using the jig substantially reduces the equipment downtime required to replace the dambar punches. The jig may also be used to remove dambar punches from the dambar punch housing.

Abstract: A leadframe inspection system, methods, and templates are provided. The leadframe inspection templates include upper and lower specification limits marks that form lead width guides. A user places a leadframe on the template, lines up the leads on the leadframe with an alignment mark, and examines the lead width in relation to the specification limits marked on the lead inspection template. The templates may be placed in the eye piece of a microscope, and thus provide a single instrument for rapidly inspecting lead widths.

Abstract: The present invention relates to a leadframe stip counting gauge and comprises a gauge member having an engagement portion adapted for association with a leadframe carrier having leadframes contained therein. The leadframe strip counting gauge further comprises leadframe count indicia associated with the gauge member, wherein the indicia are spatially distributed with respect to the gauge member and are adapted to provide a count representing a number of leadframes residing in the leadframe carrier. The present invention also relates to a method of counting leadframes residing in a leadframe carrier, and comprises positioning a leadframe counting member near a leadframe carrier containing leadframes therein. The method further comprises determining a number of leadframes in the leadframe carrier using leadframe count indicia associated with the leadframe counting member.

Abstract: A tool is provided herein for separating stacked strips of semiconductor structures held by a magazine, which strips have become attached together. The tool is made up of first and second elongated members in side-by-side relation, each member defining a plurality of teeth along an edge thereof. The first and second members are mounted together so as to allow relative reciprocal movement therebetween, so that relative reciprocal movement between the pluralities of teeth is provided. The tool is held with the teeth against the edges of strips carried by the magazine, and the operator squeezes and releases member handles to provide relative reciprocal movement of the teeth. This back-and-forth reciprocal movement causes the teeth to rub against and force apart the strips, to in turn separate them.