Patents by Inventor Aditi MALLIK

Aditi MALLIK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NOVEL DESIGN FOR FIBER ARRAY UNIT (FAU) FOR OPTICAL TRANSCEIVER PRODUCTS
    Publication number: 20240069287
    Abstract: A fiber array unit (200) and a photonics system (890), a fiber array unit (200) comprises a substrate (205) with a first el end and a second end. A first mesa (207) is adjacent to the first end and a second mesa (209) is adjacent to the second end. A v-groove (211) is in the first mesa (207) and a slot (213) is in the second mesa (209). The v-groove (211) is aligned with the slot (213).
    Type: Application
    Filed: February 26, 2021
    Publication date: February 29, 2024
    Inventors: Vinod ADIVARAHAN, Liqiang CUI, Aditi MALLIK, Boping XIE, Sunil PRIYADARSHI
  • METHODS AND APPARATUS TO REDUCE STRESS ON LASERS IN OPTICAL TRANSCEIVERS
    Publication number: 20230083610
    Abstract: Methods and apparatus to reduce stress on lasers in optical transceivers are disclosed. An apparatus comprising a printed circuit board (PCB) having a first side and a second side opposite the first side; and a first stiffener attached to the first side of the PCB; and a photonic integrated circuit (PIC) attached to the first stiffener. The first stiffener is between the PIC and the PCB. The apparatus also includes a second stiffener attached to the second side of the PCB.
    Type: Application
    Filed: September 14, 2021
    Publication date: March 16, 2023
    Inventors: Aditi Mallik, Pengyue Wen, Quan Tran, Wendai Wang, Xiaozhong Wang
  • HYBRID LASER ARCHITECTURE WITH ASYMMETRIC METAL SHUNT
    Publication number: 20230019747
    Abstract: Embodiments herein relate to an apparatus for use in a hybrid laser. The apparatus may include a silicon substrate and a waveguide to facilitate transmission of an optical signal in a first direction that is orthogonal to a surface of the silicon substrate. The apparatus may further include a metal shunt that is less than or equal to 10 micrometers from the waveguide in a second direction that is orthogonal to the surface of the silicon substrate and orthogonal to the first direction. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 23, 2022
    Publication date: January 19, 2023
    Inventors: Richard Jones, Pierre Doussiere, Aditi Mallik, Harel Frish, John Heck, Saeed Fathololoumi
  • MULTIPLE METAL LAYERS WITHIN A PHOTONICS INTEGRATED CIRCUIT FOR THERMAL TRANSFER
    Publication number: 20220416503
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to thermal routing techniques within a hybrid silicon laser or photonics integrated circuit to facilitate heat extraction during laser operation. In particular dual metal layers, with a top metal layer thermally coupled with P node above a quantum well and extending substantially under a heat sink, and a bottom metal layer thermally coupled with an N node, where the top metal layer and the bottom metal layer are not electrically coupled. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 29, 2022
    Inventors: Priyanka DOBRIYAL, Aditi MALLIK, Saeed FATHOLOLOUMI, Ankur AGRAWAL, Anna PRAKASH, Hemant Mahesh SHAH, Raiyomand ASPANDIAR, Neil Raymund CARANTO
  • HEAT EXTRACTION PATH FROM A LASER DIE USING A HIGHLY CONDUCTIVE THERMAL INTERFACE MATERIAL IN AN OPTICAL TRANSCEIVER
    Publication number: 20220199486
    Abstract: A semiconductor package comprises a substrate and a ceramic carrier mounted to the substrate. An integrated circuit (IC) die is mounted to the ceramic carrier. A heat extraction path away from the IC die comprises: i) a thermal interface material over the IC die, the thermal interface material having a thickness of approximately 25 to 80 um; ii) an integrated heat spreader over the thermal interface material; iii) a ceramic carrier plate over the integrated heat spreader; and iv) an electrically conductive thermal pad between the ceramic carrier plate and a housing of the semiconductor package.
    Type: Application
    Filed: December 22, 2020
    Publication date: June 23, 2022
    Inventors: Aditi MALLIK, Chen ZHUANG, Raghuram NARAYAN
  • PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
    Publication number: 20210210478
    Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.
    Type: Application
    Filed: March 3, 2021
    Publication date: July 8, 2021
    Inventors: Susheel JADHAV, Juan DOMINGUEZ, Ankur AGRAWAL, Kenneth BROWN, Yi LI, Jing CHEN, Aditi MALLIK, Xiaoyu HONG, Thomas LILJEBERG, Andrew C. ALDUINO, Ling LIAO, David HUI, Ren-Kang CHIOU, Harinadh POTLURI, Hari MAHALINGAM, Lobna KAMYAB, Sasanka KANUPARTHI, Sushrutha Reddy GUJJULA, Saeed FATHOLOLOUMI, Priyanka DOBRIYAL, Boping XIE, Abiola AWUJOOLA, Vladimir TAMARKIN, Keith MEASE, Stephen KEELE, David SCHWEITZER, Brent ROTHERMEL, Ning TANG, Suresh POTHUKUCHI, Srikant NEKKANTY, Zhichao ZHANG, Kaiyuan ZENG, Baikuan WANG, Donald TRAN, Ravindranath MAHAJAN, Baris BICEN, Grant SMITH