Abstract: A method of forming a perovskite film includes depositing an ink onto a substrate and annealing the substrate to form the perovskite film. The ink includes one or more 2D perovskite crystals; one or more group one cations or ammonium halides; one or more metal halides; and one or more solvents. A perovskite ink includes one or more 2D perovskite crystals, one or more group one cations or ammonium halides, one or more metal halides and one or more solvents.

Abstract: A multicomponent conductive adhesive barrier includes an adhesive layer and a conductive barrier. The adhesive layer includes a doped pressure-sensitive adhesive and the conductive barrier layer is a carbon or metal-based material. A photoelectrode structure includes a substrate, a photoabsorbing layer, a multicomponent conductive adhesive barrier, and an electrocatalyst. A method for fabricating the photoelectrode structure includes applying a photoabsorbing layer to a substrate, preparing an adhesive layer, and forming a multicomponent conductive adhesive barrier by applying a conductive barrier layer to the adhesive layer.