Patents by Inventor Aditya Dilip VERMA

Aditya Dilip VERMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITIONS FOR POLISHING HARDMASKS AND RELATED SYSTEMS AND METHODS
    Publication number: 20240247168
    Abstract: A system for polishing a hardmask comprises a composition comprising a permanganate ion of a permanganate oxidizer; a substrate comprising a hardmask that comprises at least one of a non-carbon boron component, a boron-carbon component, a non-carbon silicon component, a non-carbon chromium component, a non-carbon zirconium component, or any combination thereof; and a chemical mechanical planarization (CMP) apparatus configured to bring the composition and the substrate into contact so as to remove at least a portion of the hardmask of the substrate.
    Type: Application
    Filed: January 12, 2024
    Publication date: July 25, 2024
    Inventors: Rajiv K. Singh, Aditya Dilip Verma, Sunny De
  • METHODS AND MATERIALS FOR POLISHING OF MATERIALS
    Publication number: 20240052201
    Abstract: The present disclosure describes a slurry composition to reduce roughness a surface, such as a polycrystalline material including silicon carbide, alumina, diamond, and carbon. The present disclosure can also be applied to single crystal materials (e.g., silicon carbide, sapphire, or diamond).
    Type: Application
    Filed: August 9, 2023
    Publication date: February 15, 2024
    Inventors: Rajiv K. Singh, Sunny De, Aditya Dilip Verma
  • CMP composition for polishing hard materials
    Patent number: 11840645
    Abstract: A slurry for chemical mechanical polishing (CMP) includes an aqueous liquid carrier, an oxygen and anion containing transition metal compound or polyatomic cations including a transition metal and oxygen or hydrogen, and a per-based oxidizer. The anion for the oxygen and anion containing transition metal compound can include oxynitrate, oxychloride, oxyhydroxide, oxyacetate, oxysulfide, or oxysulfate. The per-based oxidizer can be a permanganate compound.
    Type: Grant
    Filed: January 30, 2021
    Date of Patent: December 12, 2023
    Assignee: ENTEGRIS, INC.
    Inventors: Rajiv K. Singh, Sunny De, Deepika Singh, Chaitanya Dnyanesh Ginde, Aditya Dilip Verma
  • MICROELECTRONIC DEVICE CLEANING COMPOSITION
    Publication number: 20230159866
    Abstract: Provided are compositions and methods useful in the post-CMP cleaning of microelectronic devices, in particular, devices which contain one or more surfaces comprising hydrophobic carbon or SiC. In general, the compositions comprise a chelating agent; a water-miscible solvent; a reducing agent; and a pH adjustor, wherein the composition has a pH of about 2 to about 13.
    Type: Application
    Filed: November 21, 2022
    Publication date: May 25, 2023
    Inventors: Atanu K. Das, Daniela White, Michael L. White, Jun Liu, Aditya Dilip Verma
  • CMP COMPOSITION FOR POLISHING HARD MATERIALS
    Publication number: 20210238448
    Abstract: A slurry for chemical mechanical polishing (CMP) includes an aqueous liquid carrier, an oxygen and anion containing transition metal compound or polyatomic cations including a transition metal and oxygen or hydrogen, and a per-based oxidizer. The anion for the oxygen and anion containing transition metal compound can include oxynitrate, oxychloride, oxyhydroxide, oxyacetate, oxysulfide, or oxysulfate. The per-based oxidizer can be a permanganate compound.
    Type: Application
    Filed: January 30, 2021
    Publication date: August 5, 2021
    Inventors: Rajiv K. SINGH, Sunny DE, Deepika SINGH, Chaitanya Dnyanesh GINDE, Aditya Dilip VERMA