Patents by Inventor Adnan KORKMAZ

Adnan KORKMAZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High Rate Printing of Microscale and Nanoscale Patterns Using Interfacial Convective Assembly
    Publication number: 20230145232
    Abstract: Interfacial convective assembly can assemble any type of nanoparticles or other nanoelements in minutes to form microscale and nanoscale patterns in vias or trenches in patterned substrates. The nanoelements can be assembled on both hydrophilic and hydrophobic surfaces. Nanoparticles can fuse during the process to provide solid or single crystalline electrical circuit components.
    Type: Application
    Filed: April 12, 2021
    Publication date: May 11, 2023
    Inventors: Zhimin CHAI, Adnan KORKMAZ, Cihan YILMAZ, Ahmed A. BUSNAINA