Patents by Inventor Adolf Buschfeld

Adolf Buschfeld has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing urea-modified, highly reactive phenolic resins useful as bonding agents for center-layer particles in the manufacture of particleboard
    Patent number: 5681916
    Abstract: Urea-modified, highly reactive phenolic resins useful as center-layer bonding agents in the manufacture of particleboard are provided by condensing phenol and formaldehyde until shortly before gelation takes place such that, after addition of urea, relatively low-alkaline, urea-modified phenolic resins are obtained which my optionally be stored and to which, shortly before processing them into glues for center-layer particles, alkali is added in sufficient quantities to ensure rapid cross-linking of the phenolic resin.
    Type: Grant
    Filed: June 29, 1995
    Date of Patent: October 28, 1997
    Assignee: RWE-DEA Aktiengesellschaft fur Mineraloel und Chemie
    Inventors: Adolf Buschfeld, Matthias Lattekamp, Manfred Gramse, Hans-Jurgen Krezmin
  • Process for producing modified phenolic resin bonding agents and use thereof for producing particle board
    Patent number: 5011886
    Abstract: The inventive concept is to condense the phenol formaldehyde resins to a higher molecular weight than usual so far. Subsequent addition of urea thereto reduces viscosity to normal levels and increases solid content.The added urea does not take part in condensation reaction but partly reacts in the alkaline medium with formaldehyde to methylol urea (in a so called equilibrium reaction), which is formaldehyde donor for the phenol formaldehyde crosslinking reaction during the pressing of the particle board.The present invention relates to a process for producing modified phenolic resin bonding agents, characterized by preparing as known per se phenol-formaldehyde resins with a viscosity of more than 300 mPa.s (at 20.degree. C.
    Type: Grant
    Filed: February 26, 1990
    Date of Patent: April 30, 1991
    Assignee: Rwe-Dea Aktiengesellschaft fur Mineraloel und Chemie
    Inventors: Adolf Buschfeld, Matthias Lattekamp, Gerd Ripkens, Hans Schittek
  • Process for the manufacture of multi-layer particle board using a phenol formaldehyde resin having a lower solids content
    Patent number: 4525227
    Abstract: A process for the manufacture of triple- and multi-layer particle board employing phenol formaldehyde resin compositions for gluing particles in the outer layers of the board characterized by the use of a phenol formaldehyde resin composition having a viscosity of about 30-90 seconds (4-mm DIN cup), a solids content of between about 30 and 39 percent by weight and an alkali content of less than 8 percent by weight is provided.
    Type: Grant
    Filed: December 5, 1983
    Date of Patent: June 25, 1985
    Assignee: Deutsche Texaco Aktiengesellschaft
    Inventors: Gerd Ripkens, Hans Schittek, Adolf Buschfeld
  • Process for preparing low viscosity fatty acid-modified polyesters
    Patent number: 4045391
    Abstract: In contrast to the known alkyd resins (fatty acid-modified polyesters) produced by way of esterification reaction, the alkyd resins according to this invention are produced by way of successive addition reactions. As a result, the structure and the chain length of the molecules can be predetermined, and the products obtained consist of uniform polyester molecules. Such products have viscosities lower than that of the known alkyd resins, thereby permitting the production of baking varnish systems comprising a low solvent content.
    Type: Grant
    Filed: February 17, 1976
    Date of Patent: August 30, 1977
    Assignee: Deutsche Texaco Aktiengesellschaft
    Inventor: Adolf Buschfeld
  • Process for the manufacture of chip boards using condensation resins as binders and product
    Patent number: 3968308
    Abstract: The present invention relates to a process for the manufacture of chip boards especially multi-layer chip boards, using condensation resins as binders, and the products thereof the improvement including wetting powdered adhesive particles before applying the adhesive particles to wood chips.
    Type: Grant
    Filed: December 16, 1974
    Date of Patent: July 6, 1976
    Assignee: Deutsche Texaco Aktiengesellschaft
    Inventors: Adolf Buschfeld, Manfred Gramse, Dragomir Simic