Patents by Inventor Adolfo Gomez
Adolfo Gomez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10992077Abstract: A mechanical interlock for securing a cover to a housing may include a cover latch coupled to a wall of a housing, and a spring biasing the cover latch in a first direction and coupled between the wall of the housing and the cover latch. The mechanical interlock may further include an arm coupled to the cover latch at a first end of the arm, and an electrical socket aperture defined within the wall of the housing juxtaposed to a second end of the arm. When the cover latch is returned to the first position via the spring after the cover is removed from the housing, the arm permits for the electrical cord to interface with the electrical socket.Type: GrantFiled: January 17, 2017Date of Patent: April 27, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Adolfo Gomez, Roger A. Pearson, Richard Duran
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Publication number: 20210089638Abstract: An enhanced reality system that includes a plurality of sensors to detect relative positions of a user's body and changes in positions of the plurality of sensors over time and a controller to: receive data from the sensors and determine a gesture made by the user; and an authentication module to, when executed by the controller translate the gesture into a passcode and authorize access to digital content based on verification of the passcode.Type: ApplicationFiled: June 12, 2018Publication date: March 25, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Peter Seiler, Adolfo Adolfo Gomez, Connor Jam Watkins
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Publication number: 20200333856Abstract: Examples herein relate to faceplates with filters. In some examples, an apparatus can include a faceplate, where the faceplate includes a plurality of perforations through a thickness of the faceplate, a filter attached to the faceplate, and a magnet to generate a magnetic attraction force between the faceplate and the filter such that the filter is magnetically attached to the faceplate.Type: ApplicationFiled: November 20, 2017Publication date: October 22, 2020Applicant: Hewlett-Packard Development Company, L.P.Inventors: David Quijano, Tom J. Searby, Adolfo A. Gomez
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Patent number: 10810152Abstract: A computing system for housing a number of storage devices includes a number of device cages, and a backplane coupled to each of the device cages to electrically couple a number of the storage devices to the computing system. The backplane includes a number of device combination signal and power interfaces located on a first side of the backplane to couple a number of the storage devices to the backplane. The backplane further includes a number of combination signal and power interfaces located on a second side of the backplane to couple the backplane to the computing system. The backplane further includes a number of signal connectors to couple the backplane to the computing system.Type: GrantFiled: January 3, 2019Date of Patent: October 20, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Adolfo Gomez, Tom J. Searby, Omar Guadalupe Pena, Jonathan D. Bassett
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Patent number: 10772186Abstract: A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB.Type: GrantFiled: January 29, 2015Date of Patent: September 8, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Adolfo Gomez, Tom J. Searby, Andrew L. Wiltzius
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Publication number: 20200223114Abstract: One example includes an injection-molded component comprising a surface surrounded by peripheral edges and which is formed via an injection-molding process. The surface includes a three-dimensional surface feature to render the surface as being non-planar across at least a portion of the surface. The surface also includes a plurality of holographic micro-features formed across the surface and being to interact with ambient light to provide a holographic image corresponding to an authentication mark associated with the injection-molded component.Type: ApplicationFiled: January 30, 2017Publication date: July 16, 2020Inventors: Adolfo Gomez, William E. Gallahan, Jack Hui He
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Publication number: 20190363483Abstract: A mechanical interlock for securing a cover to a housing may include a cover latch coupled to a wall of a housing, and a spring biasing the cover latch in a first direction and coupled between the wall of the housing and the cover latch. The mechanical interlock may further include an arm coupled to the cover latch at a first end of the arm, and an electrical socket aperture defined within the wall of the housing juxtaposed to a second end of the arm. When the cover latch is returned to the first position via the spring after the cover is removed from the housing, the arm permits for the electrical cord to interface with the electrical socket.Type: ApplicationFiled: January 17, 2017Publication date: November 28, 2019Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Adolfo Gomez, Roger A. Pearson, Richard Duran
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Publication number: 20190313527Abstract: Examples disclosed herein relate to a rigid board with a pliable region. An example system can include a board including a cut to form a beam region of pliability in the board. An example system may include a component to be mounted on the beam region. In an example, the cut can increase flexibility of the beam region relative to the board allowing movement of the component to a target alignment for the component.Type: ApplicationFiled: October 10, 2016Publication date: October 10, 2019Applicant: HEWLETT- PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Roger A. Pearson, Adolfo A. Gomez
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Patent number: 10372173Abstract: An example enclosure for a computing device includes a frame having an opening to receive a computing device, a plurality of panels and a retaining mechanism to retain the computing device within the frame. One of the plurality of panels comprises a port access opening. The enclosure also includes a security insert to be secured to the frame to restrict access to a port of the computing device through the port access opening.Type: GrantFiled: September 19, 2017Date of Patent: August 6, 2019Assignee: Hewlett-Packard Development Company, L.P.Inventors: David Quijano, Adolfo Adolfo Gomez
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Patent number: 10297938Abstract: In one implementation, an apparatus for card edge connector couplings includes a card edge connector coupled to a card edge, and a number of conductors coupling the card edge to a device connector.Type: GrantFiled: June 10, 2015Date of Patent: May 21, 2019Assignee: Hewlett-Packard Development Company, L.P.Inventors: Adolfo A. Gomez, Jonathan D. Bassett, Byron A. Alcorn
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Publication number: 20190138482Abstract: A computing system for housing a number of storage devices includes a number of device cages, and a backplane coupled to each of the device cages to electrically couple a number of the storage devices to the computing system. The backplane includes a number of device combination signal and power interfaces located on a first side of the backplane to couple a number of the storage devices to the backplane. The backplane further includes a number of combination signal and power interfaces located on a second side of the backplane to couple the backplane to the computing system. The backplane further includes a number of signal connectors to couple the backplane to the computing system.Type: ApplicationFiled: January 3, 2019Publication date: May 9, 2019Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Adolfo Gomez, Tom J. Searby, Omar Guadalupe Pena, Jonathan D. Bassett
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Publication number: 20190086972Abstract: An example enclosure for a computing device includes a frame having an opening to receive a computing device, a plurality of panels and a retaining mechanism to retain the computing device within the frame. One of the plurality of panels comprises a port access opening. The enclosure also includes a security insert to be secured to the frame to restrict access to a port of the computing device through the port access opening.Type: ApplicationFiled: September 19, 2017Publication date: March 21, 2019Applicant: Hewlett-Packard Development Company, L.P.Inventors: David Quijano, Adolfo Adolfo Gomez
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Patent number: 10094492Abstract: Example implementations relate to integral mounting features. In one example, a conduit includes a first endpoint, a second endpoint, an exterior surface, and a mounting feature integral with a portion of the exterior surface to removably couple to a corresponding mounting feature integral with a surface of an object, where the mounting feature is located between the first endpoint and the second endpoint of the conduit.Type: GrantFiled: June 10, 2015Date of Patent: October 9, 2018Assignee: Hewlett-Packard Development Company, L.P.Inventors: Adolfo Gomez, Thomas A. Bondurant, Omar Pena
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Publication number: 20180279462Abstract: A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB.Type: ApplicationFiled: January 29, 2015Publication date: September 27, 2018Inventors: Adolfo Gomez, Tom J. Searby, Andrew L. Wiltzius
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Publication number: 20180138613Abstract: In one implementation, an apparatus for card edge connector couplings includes a card edge connector coupled to a card edge, and a number of conductors coupling the card edge to a device connector.Type: ApplicationFiled: June 10, 2015Publication date: May 17, 2018Applicant: Hewlett-Packard Development Company, L.P.Inventors: Adolfo Gomez, Jonathan D. Bassett, Byron A. Alcorn
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Publication number: 20180128398Abstract: Example implementations relate to integral mounting features. In one example, a conduit includes a first endpoint, a second endpoint, an exterior surface, and a mounting feature integral with a portion of the exterior surface to removably couple to a corresponding mounting feature integral with a surface of an object, where the mounting feature is located between the first endpoint and the second endpoint of the conduit.Type: ApplicationFiled: June 10, 2015Publication date: May 10, 2018Applicant: Hewlett-Packard Development Company, L.P.Inventors: Adolfo GOMEZ, Thomas A. BONDURANT, Omar PENA
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Publication number: 20160217097Abstract: A computing system for housing a number of storage devices includes a number of device cages, and a backplane coupled to each of the device cages to electrically couple a number of the storage devices to the computing system. The backplane includes a number of device combination signal and power interfaces located on a first side of the backplane to couple a number of the storage devices to the backplane. The backplane further includes a number of combination signal and power interfaces located on a second side of the backplane to couple the backplane to the computing system. The backplane further includes a number of signal connectors to couple the backplane to the computing system.Type: ApplicationFiled: January 26, 2015Publication date: July 28, 2016Inventors: Adolfo Gomez, Tom J. Searby, Omar Guadalupe Pena, Jonathan D. Bassett
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Patent number: 9368921Abstract: An interconnect assembly includes a housing, multiple signal connectors provided on the housing, a power bus having one or more bus elements, and a combination connector. The multiple signal connectors include a first signal connector and a second signal connector, and each signal connector includes a plurality of signal elements. The combination connector is provided on the housing and includes a plurality of connection elements, including a first set of connection elements which route within the housing to the plurality of signal elements of the first signal connector, a second set of connection elements which route within the housing to the plurality of signal elements of the second signal connector, and a third set of connection elements which route within the housing to the one or more bus elements of the power bus.Type: GrantFiled: February 24, 2015Date of Patent: June 14, 2016Assignee: Hewlett-Packard Development Company, L.P.Inventors: Adolfo Adolfo Gomez, Tom J. Searby
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Publication number: 20150171565Abstract: An interconnect assembly includes a housing, multiple signal connectors provided on the housing, a power bus having one or more bus elements, and a combination connector. The multiple signal connectors include a first signal connector and a second signal connector, and each signal connector includes a plurality of signal elements. The combination connector is provided on the housing and includes a plurality of connection elements, including a first set of connection elements which route within the housing to the plurality of signal elements of the first signal connector, a second set of connection elements which route within the housing to the plurality of signal elements of the second signal connector, and a third set of connection elements which route within the housing to the one or more bus elements of the power bus.Type: ApplicationFiled: February 24, 2015Publication date: June 18, 2015Inventors: Adolfo Adolfo Gomez, Tom J. Searby
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Patent number: 8998636Abstract: An interconnect assembly and system are disclosed herein. An example of the interconnect assembly includes a first signal connector and a second signal connector. The example also includes a combination connector coupled to the first signal connector and the second signal connector. The example further includes a power bus coupled to the combination connector to supply power to the combination connector. Other elements, components, and features of the interconnect assembly are disclosed herein as are alternative examples of interconnect assemblies. Elements, components, and features of the system are also disclosed herein as are alternative examples of the system.Type: GrantFiled: January 29, 2013Date of Patent: April 7, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Adolfo Adolfo Gomez, Tom J. Searby