Patents by Inventor Adolfo Gomez

Adolfo Gomez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10992077
    Abstract: A mechanical interlock for securing a cover to a housing may include a cover latch coupled to a wall of a housing, and a spring biasing the cover latch in a first direction and coupled between the wall of the housing and the cover latch. The mechanical interlock may further include an arm coupled to the cover latch at a first end of the arm, and an electrical socket aperture defined within the wall of the housing juxtaposed to a second end of the arm. When the cover latch is returned to the first position via the spring after the cover is removed from the housing, the arm permits for the electrical cord to interface with the electrical socket.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: April 27, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Adolfo Gomez, Roger A. Pearson, Richard Duran
  • Publication number: 20210089638
    Abstract: An enhanced reality system that includes a plurality of sensors to detect relative positions of a user's body and changes in positions of the plurality of sensors over time and a controller to: receive data from the sensors and determine a gesture made by the user; and an authentication module to, when executed by the controller translate the gesture into a passcode and authorize access to digital content based on verification of the passcode.
    Type: Application
    Filed: June 12, 2018
    Publication date: March 25, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Peter Seiler, Adolfo Adolfo Gomez, Connor Jam Watkins
  • Publication number: 20200333856
    Abstract: Examples herein relate to faceplates with filters. In some examples, an apparatus can include a faceplate, where the faceplate includes a plurality of perforations through a thickness of the faceplate, a filter attached to the faceplate, and a magnet to generate a magnetic attraction force between the faceplate and the filter such that the filter is magnetically attached to the faceplate.
    Type: Application
    Filed: November 20, 2017
    Publication date: October 22, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: David Quijano, Tom J. Searby, Adolfo A. Gomez
  • Patent number: 10810152
    Abstract: A computing system for housing a number of storage devices includes a number of device cages, and a backplane coupled to each of the device cages to electrically couple a number of the storage devices to the computing system. The backplane includes a number of device combination signal and power interfaces located on a first side of the backplane to couple a number of the storage devices to the backplane. The backplane further includes a number of combination signal and power interfaces located on a second side of the backplane to couple the backplane to the computing system. The backplane further includes a number of signal connectors to couple the backplane to the computing system.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: October 20, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Adolfo Gomez, Tom J. Searby, Omar Guadalupe Pena, Jonathan D. Bassett
  • Patent number: 10772186
    Abstract: A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: September 8, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Adolfo Gomez, Tom J. Searby, Andrew L. Wiltzius
  • Publication number: 20200223114
    Abstract: One example includes an injection-molded component comprising a surface surrounded by peripheral edges and which is formed via an injection-molding process. The surface includes a three-dimensional surface feature to render the surface as being non-planar across at least a portion of the surface. The surface also includes a plurality of holographic micro-features formed across the surface and being to interact with ambient light to provide a holographic image corresponding to an authentication mark associated with the injection-molded component.
    Type: Application
    Filed: January 30, 2017
    Publication date: July 16, 2020
    Inventors: Adolfo Gomez, William E. Gallahan, Jack Hui He
  • Publication number: 20190363483
    Abstract: A mechanical interlock for securing a cover to a housing may include a cover latch coupled to a wall of a housing, and a spring biasing the cover latch in a first direction and coupled between the wall of the housing and the cover latch. The mechanical interlock may further include an arm coupled to the cover latch at a first end of the arm, and an electrical socket aperture defined within the wall of the housing juxtaposed to a second end of the arm. When the cover latch is returned to the first position via the spring after the cover is removed from the housing, the arm permits for the electrical cord to interface with the electrical socket.
    Type: Application
    Filed: January 17, 2017
    Publication date: November 28, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Adolfo Gomez, Roger A. Pearson, Richard Duran
  • Publication number: 20190313527
    Abstract: Examples disclosed herein relate to a rigid board with a pliable region. An example system can include a board including a cut to form a beam region of pliability in the board. An example system may include a component to be mounted on the beam region. In an example, the cut can increase flexibility of the beam region relative to the board allowing movement of the component to a target alignment for the component.
    Type: Application
    Filed: October 10, 2016
    Publication date: October 10, 2019
    Applicant: HEWLETT- PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Roger A. Pearson, Adolfo A. Gomez
  • Patent number: 10372173
    Abstract: An example enclosure for a computing device includes a frame having an opening to receive a computing device, a plurality of panels and a retaining mechanism to retain the computing device within the frame. One of the plurality of panels comprises a port access opening. The enclosure also includes a security insert to be secured to the frame to restrict access to a port of the computing device through the port access opening.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: August 6, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David Quijano, Adolfo Adolfo Gomez
  • Patent number: 10297938
    Abstract: In one implementation, an apparatus for card edge connector couplings includes a card edge connector coupled to a card edge, and a number of conductors coupling the card edge to a device connector.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: May 21, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Adolfo A. Gomez, Jonathan D. Bassett, Byron A. Alcorn
  • Publication number: 20190138482
    Abstract: A computing system for housing a number of storage devices includes a number of device cages, and a backplane coupled to each of the device cages to electrically couple a number of the storage devices to the computing system. The backplane includes a number of device combination signal and power interfaces located on a first side of the backplane to couple a number of the storage devices to the backplane. The backplane further includes a number of combination signal and power interfaces located on a second side of the backplane to couple the backplane to the computing system. The backplane further includes a number of signal connectors to couple the backplane to the computing system.
    Type: Application
    Filed: January 3, 2019
    Publication date: May 9, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Adolfo Gomez, Tom J. Searby, Omar Guadalupe Pena, Jonathan D. Bassett
  • Publication number: 20190086972
    Abstract: An example enclosure for a computing device includes a frame having an opening to receive a computing device, a plurality of panels and a retaining mechanism to retain the computing device within the frame. One of the plurality of panels comprises a port access opening. The enclosure also includes a security insert to be secured to the frame to restrict access to a port of the computing device through the port access opening.
    Type: Application
    Filed: September 19, 2017
    Publication date: March 21, 2019
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: David Quijano, Adolfo Adolfo Gomez
  • Patent number: 10094492
    Abstract: Example implementations relate to integral mounting features. In one example, a conduit includes a first endpoint, a second endpoint, an exterior surface, and a mounting feature integral with a portion of the exterior surface to removably couple to a corresponding mounting feature integral with a surface of an object, where the mounting feature is located between the first endpoint and the second endpoint of the conduit.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: October 9, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Adolfo Gomez, Thomas A. Bondurant, Omar Pena
  • Publication number: 20180279462
    Abstract: A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB.
    Type: Application
    Filed: January 29, 2015
    Publication date: September 27, 2018
    Inventors: Adolfo Gomez, Tom J. Searby, Andrew L. Wiltzius
  • Publication number: 20180138613
    Abstract: In one implementation, an apparatus for card edge connector couplings includes a card edge connector coupled to a card edge, and a number of conductors coupling the card edge to a device connector.
    Type: Application
    Filed: June 10, 2015
    Publication date: May 17, 2018
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Adolfo Gomez, Jonathan D. Bassett, Byron A. Alcorn
  • Publication number: 20180128398
    Abstract: Example implementations relate to integral mounting features. In one example, a conduit includes a first endpoint, a second endpoint, an exterior surface, and a mounting feature integral with a portion of the exterior surface to removably couple to a corresponding mounting feature integral with a surface of an object, where the mounting feature is located between the first endpoint and the second endpoint of the conduit.
    Type: Application
    Filed: June 10, 2015
    Publication date: May 10, 2018
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Adolfo GOMEZ, Thomas A. BONDURANT, Omar PENA
  • Publication number: 20160217097
    Abstract: A computing system for housing a number of storage devices includes a number of device cages, and a backplane coupled to each of the device cages to electrically couple a number of the storage devices to the computing system. The backplane includes a number of device combination signal and power interfaces located on a first side of the backplane to couple a number of the storage devices to the backplane. The backplane further includes a number of combination signal and power interfaces located on a second side of the backplane to couple the backplane to the computing system. The backplane further includes a number of signal connectors to couple the backplane to the computing system.
    Type: Application
    Filed: January 26, 2015
    Publication date: July 28, 2016
    Inventors: Adolfo Gomez, Tom J. Searby, Omar Guadalupe Pena, Jonathan D. Bassett
  • Patent number: 9368921
    Abstract: An interconnect assembly includes a housing, multiple signal connectors provided on the housing, a power bus having one or more bus elements, and a combination connector. The multiple signal connectors include a first signal connector and a second signal connector, and each signal connector includes a plurality of signal elements. The combination connector is provided on the housing and includes a plurality of connection elements, including a first set of connection elements which route within the housing to the plurality of signal elements of the first signal connector, a second set of connection elements which route within the housing to the plurality of signal elements of the second signal connector, and a third set of connection elements which route within the housing to the one or more bus elements of the power bus.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: June 14, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Adolfo Adolfo Gomez, Tom J. Searby
  • Publication number: 20150171565
    Abstract: An interconnect assembly includes a housing, multiple signal connectors provided on the housing, a power bus having one or more bus elements, and a combination connector. The multiple signal connectors include a first signal connector and a second signal connector, and each signal connector includes a plurality of signal elements. The combination connector is provided on the housing and includes a plurality of connection elements, including a first set of connection elements which route within the housing to the plurality of signal elements of the first signal connector, a second set of connection elements which route within the housing to the plurality of signal elements of the second signal connector, and a third set of connection elements which route within the housing to the one or more bus elements of the power bus.
    Type: Application
    Filed: February 24, 2015
    Publication date: June 18, 2015
    Inventors: Adolfo Adolfo Gomez, Tom J. Searby
  • Patent number: 8998636
    Abstract: An interconnect assembly and system are disclosed herein. An example of the interconnect assembly includes a first signal connector and a second signal connector. The example also includes a combination connector coupled to the first signal connector and the second signal connector. The example further includes a power bus coupled to the combination connector to supply power to the combination connector. Other elements, components, and features of the interconnect assembly are disclosed herein as are alternative examples of interconnect assemblies. Elements, components, and features of the system are also disclosed herein as are alternative examples of the system.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: April 7, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Adolfo Adolfo Gomez, Tom J. Searby