Abstract: A method of checking a seal of a probe chamber or test chamber (thermal chamber) during a freezing temperature chamber condition. The thermal chamber provided includes a probe card or a contactor for electrically testing a semiconductor device under test (DUT), a gas inlet, a chiller which provides a freezing chamber temperature, and a pressure sensor for sensing a pressure in the thermal chamber (chamber pressure). Using the pressure sensor, the chamber pressure is sensed while flowing a dry gas through the gas inlet sufficient to render the chamber pressure a positive pressure. The positive pressure is compared to a reference pressure, and from the comparing it is determined whether the thermal chamber is properly sealed.

Abstract: A method of checking a seal of a probe chamber or test chamber (thermal chamber) during a freezing temperature chamber condition. The thermal chamber provided includes a probe card or a contactor for electrically testing a semiconductor device under test (DUT), a gas inlet, a chiller which provides a freezing chamber temperature, and a pressure sensor for sensing a pressure in the thermal chamber (chamber pressure). Using the pressure sensor, the chamber pressure is sensed while flowing a dry gas through the gas inlet sufficient to render the chamber pressure a positive pressure. The positive pressure is compared to a reference pressure, and from the comparing it is determined whether the thermal chamber is properly sealed.

Abstract: One aspect of the invention provides an apparatus that includes a probe card [105] having probe needles [120] associated therewith. A temperature stabilizer element [135] is couplable to the probe card [105]. The temperature stabilizer [135] is configured to either raise or lower a temperature of the probe needles [120] to reduce movement of the probe needles [120].

Abstract: One aspect of the invention provides an apparatus that includes a probe card having probe needles associated therewith. A temperature stabilizer element is couplable to the probe card. The temperature stabilizer is configured to either raise or lower a temperature of the probe needles to reduce movement of the probe needles.

Abstract: In one embodiment, a method for probing a wafer includes providing a plurality of pressure sensors on a surface of a probe card holding tray, positioning a probe card of a testhead relative to a prober supporting a wafer, engaging the probe card with the probe card holding tray, receiving a plurality of pressure signals from respective pressure sensors, and comparing the pressure signals to determine if the probe card is substantially parallel with the prober.

Abstract: Disclosed is a lighted wafer cassette for use in semiconductor wafer processing. Also disclosed are systems and methods employing a wafer cassette lighted with one or more affixed light sources for facilitating cassette alignment with standard semiconductor processing apparatus.

Abstract: Disclosed is a lighted wafer cassette for use in semiconductor wafer processing. Also disclosed are systems and methods employing a wafer cassette lighted with one or more affixed light sources for facilitating cassette alignment with standard semiconductor processing apparatus.

Abstract: An apparatus for releasably clamping a substrate to a support platform, or other support means, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

Abstract: An apparatus for releasably clamping a substrate to a support platform, or other support system, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.