Abstract: An optical transceiver may include a housing including a surface cutout. The surface cutout may be for receiving a locking tang from a cage and for being disengaged by a slide from an unlocking tool wherein the surface cutout is disposed on the housing at a position such that the surface cutout is entirely within the cage with respect to an electromagnetic interference (EMI) gasket of the cage when the optical transceiver is inserted into the cage.

Abstract: An optical transceiver may include a housing including a surface cutout. The surface cutout may be for receiving a locking tang from a cage and for being disengaged by a slide from an unlocking tool wherein the surface cutout is disposed on the housing at a position such that the surface cutout is entirely within the cage with respect to an electromagnetic interference (EMI) gasket of the cage when the optical transceiver is inserted into the cage.

Abstract: An optical transceiver may include a housing including a surface cutout. The surface cutout may be for receiving a locking tang from a cage and for being disengaged by a slide from an unlocking tool wherein the surface cutout is disposed on the housing at a position such that the surface cutout is entirely within the cage with respect to an electromagnetic interference (EMI) gasket of the cage when the optical transceiver is inserted into the cage.

Abstract: An optical transceiver may include a housing including a surface cutout. The surface cutout may be for receiving a locking tang from a cage and for being disengaged by a slide from an unlocking tool wherein the surface cutout is disposed on the housing at a position such that the surface cutout is entirely within the cage with respect to an electromagnetic interference (EMI) gasket of the cage when the optical transceiver is inserted into the cage.

Abstract: An optomechanical assembly for a photonic chip is disclosed. The optomechanical assembly may include a planar lightwave circuit optically coupled to a plurality of vertical coupling gratings on the photonic chip, to couple light between an optical connector abutting the planar lightwave circuit and the photonic chip.

Abstract: An engineering order wire arrangement is provided for a synchronous telecommunications network comprising a plurality of nodes interconnected via transmission paths, each path accommodating a plurality of transmission channels. Engineering voice traffic is carried on a first overhead channel having a defined network route topology. A second overhead channel is used to define a model network having a a route topology identical to that of the first overhead channel. The model network is tested to determine its integrity, i.e. the absence of loops. If the model network is found to be defective, both networks are reconfigured.