Patents by Inventor Adonis Fung

Adonis Fung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadless integrated circuit package having standoff contacts and die attach pad
    Patent number: 9305889
    Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: April 5, 2016
    Assignee: UTAC Hong Kong Limited
    Inventors: Kirk Powell, John McMillan, Adonis Fung, Serafin P. Pedron, Jr.
  • LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD
    Publication number: 20140367865
    Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.
    Type: Application
    Filed: May 27, 2014
    Publication date: December 18, 2014
    Applicant: UTAC Hong Kong Limited
    Inventors: Kirk POWELL, John McMILLAN, Adonis FUNG, Serafin P. PEDRON, JR.
  • Leadless array plastic package with various IC packaging configurations
    Patent number: 8828801
    Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted to a die-attach area and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die-attach area are all covered with a molding material, with portions of the electrical contacts and die-attach area protruding from a bottom surface of the molding material.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: September 9, 2014
    Assignee: UTAC Hong Kong Limited
    Inventors: John McMillan, Serafin P. Pedron, Jr., Kirk Powell, Adonis Fung
  • Leadless integrated circuit package having standoff contacts and die attach pad
    Patent number: 8736037
    Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: May 27, 2014
    Assignee: UTAC Hong Kong Limited
    Inventors: Kirk Powell, John McMillan, Adonis Fung, Serafin P. Pedron, Jr.
  • LEADLESS ARRAY PLASTIC PACKAGE WITH VARIOUS IC PACKAGING CONFIGURATIONS
    Publication number: 20130273692
    Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted to a die-attach area and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die-attach area are all covered with a molding material, with portions of the electrical contacts and die-attach area protruding from a bottom surface of the molding material.
    Type: Application
    Filed: June 12, 2013
    Publication date: October 17, 2013
    Inventors: John MCMILLAN, Serafin P. PEDRON, JR., Kirk POWELL, Adonis FUNG
  • Leadless array plastic package with various IC packaging configurations
    Patent number: 8486762
    Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted to a die-attach area and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die-attach area are all covered with a molding material, with portions of the electrical contacts and die-attach area protruding from a bottom surface of the molding material.
    Type: Grant
    Filed: March 8, 2010
    Date of Patent: July 16, 2013
    Assignee: UTAC Hong Kong Limited
    Inventors: John McMillan, Serafin P. Pedron, Jr., Kirk Powell, Adonis Fung
  • Leadless integrated circuit package having standoff contacts and die attach pad
    Patent number: 7858443
    Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: December 28, 2010
    Assignee: UTAC Hong Kong Limited
    Inventors: Kirk Powell, John McMillan, Adonis Fung, Serafin Pedron, Jr.
  • LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD
    Publication number: 20100224970
    Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.
    Type: Application
    Filed: March 9, 2009
    Publication date: September 9, 2010
    Applicant: Asat Ltd.
    Inventors: Kirk POWELL, John MCMILLAN, Adonis FUNG, Serafin PEDRON, JR.
  • LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD
    Publication number: 20100224972
    Abstract: A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material.
    Type: Application
    Filed: May 7, 2010
    Publication date: September 9, 2010
    Inventors: Kirk POWELL, John MCMILLAN, Adonis FUNG, Serafin PEDRON, JR.