Abstract: An electronic device (100) comprises an electronics substrate (10) with at least one light emitting device (12), a cover substrate (20) with a graphical pattern including at least one window (22), and a thermoplastic layer (30) there between. A multilayer laminate (40) of the device (100) is formed by combining the electronics substrate (10) and the cover substrate (20) by lamination with protruding electronic components (11,12) facing the thermoplastic layer (30). At least the thermoplastic layer (30) is heated to a lamination temperature (T1) for increasing a plasticity of the thermoplastic material (30m). The electronic components (11,12) are pushed by the lamination into the heated thermoplastic layer (30) for embedding the electronic components (11,12) in the thermoplastic material (30m).

Abstract: A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11.12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L) and a surrounding area (12) of the substrate (13) outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).

Abstract: Illuminating sections of a light guide with LEDs leads to unwanted light bleeding to other parts of the light guide. Furthermore typically LEDs are placed at a large distance from the area that couples out light from this LED due to a spike in intensity close to the LED. In order to avoid this spike being visible in the lit area the distance is increased which results in unwanted areal increase of the overall system. The present provides a layout to overcome these challenges.

Abstract: Illuminating sections of a light guide with LEDs leads to unwanted light bleeding to other parts of the light guide. Furthermore typically LEDs are placed at a large distance from the area that couples out light from this LED due to a spike in intensity close to the LED. In order to avoid this spike being visible in the lit area the distance is increased which results in unwanted areal increase of the overall system. The present provides a layout to overcome these challenges.

Abstract: A semimanufacture intended to be mounted on a vibrating wall or a vibrating panel for actively damping the vibrations in the wall or the panel with frequencies which are at least partly audible, wherein the semimanufacture is provided with a plate wherein the plate is integrated with: at least one vibration source for generating vibrations which, in use, damp the vibrations of the wall or the panel, at least one vibration sensor for detecting the vibrations in the wall or in the panel and wiring for connecting the vibration source and/or the vibration sensor with a control unit for processing signals coming from the at least one vibration sensor and for controlling the at least one vibration source.