Patents by Inventor Adrian Blank
Adrian Blank has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240072785Abstract: An electronic circuit and a method are disclosed. The electronic circuit includes: a first transistor device having a load path between a first load path node and a second load path node; and a clamping circuit connected to the load path of the first transistor device. The clamping circuit includes: a second transistor device having a load path connected in parallel with the load path of the first transistor device, and a control node; and a drive circuit configured to drive the second transistor device. The drive circuit includes a clamping element and a resistor connected in series between the first and second load path nodes of the first transistor device. The drive circuit is configured to drive the second transistor device dependent on a voltage across the resistor. The first transistor device and the clamping circuit are integrated in a same semiconductor die.Type: ApplicationFiled: August 9, 2023Publication date: February 29, 2024Inventors: Adrian Finney, Oliver Blank, Gerhard Prechtl, Dirk Ahlers, Gerhard Nöbauer, Marius Aurel Bodea, Joachim Schönle, Oliver Häberlen
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Patent number: 11721563Abstract: A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.Type: GrantFiled: October 21, 2021Date of Patent: August 8, 2023Assignee: Applied Materials, Inc.Inventors: Jagan Rangarajan, Adrian Blank, Edward Golubovsky, Balasubramaniam Coimbatore Jaganathan, Steven M. Zuniga, Ekaterina Mikhaylichenko, Michael A. Anderson, Jonathan P. Domin
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Patent number: 11289347Abstract: A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.Type: GrantFiled: August 6, 2019Date of Patent: March 29, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Jagan Rangarajan, Adrian Blank, Edward Golubovsky, Balasubramaniam Coimbatore Jaganathan, Steven M. Zuniga, Ekaterina Mikhaylichenko, Michael A. Anderson, Jonathan P. Domin
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Publication number: 20220044946Abstract: A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.Type: ApplicationFiled: October 21, 2021Publication date: February 10, 2022Inventors: Jagan RANGARAJAN, Adrian BLANK, Edward GOLUBOVSKY, Balasubramaniam Coimbatore JAGANATHAN, Steven M. ZUNIGA, Ekaterina MIKHAYLICHENKO, Michael A. ANDERSON, Jonathan P. DOMIN
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Patent number: 11158524Abstract: A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.Type: GrantFiled: August 6, 2019Date of Patent: October 26, 2021Assignee: Applied Materials, Inc.Inventors: Jagan Rangarajan, Adrian Blank, Edward Golubovsky, Balasubramaniam Coimbatore Jaganathan, Steven M. Zuniga, Ekaterina Mikhaylichenko, Michael A. Anderson, Jonathan P. Domin
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Publication number: 20200043756Abstract: A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.Type: ApplicationFiled: August 6, 2019Publication date: February 6, 2020Inventors: Jagan RANGARAJAN, Adrian BLANK, Edward GOLUBOVSKY, Balasubramaniam Coimbatore JAGANATHAN, Steven M. ZUNIGA, Ekaterina MIKHAYLICHENKO, Michael A. ANDERSON, Jonathan P. DOMIN
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Patent number: 9646859Abstract: Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.Type: GrantFiled: April 30, 2010Date of Patent: May 9, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Hui Chen, Allen L. D'Ambra, Sen-Hou Ko, Yufei Chen, Adrian Blank, Mario D. Silvetti, Gerald J. Alonzo, Lakshmanan Karuppiah
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Publication number: 20110265816Abstract: Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.Type: ApplicationFiled: April 30, 2010Publication date: November 3, 2011Applicant: APPLIED MATERIALS, INC.Inventors: Hui Chen, Allen L. D'Ambra, Sen-Hou Ko, Yufei Chen, Adrian Blank, Mario D. Silvetti, Gerald J. Alonzo, Lakshmanan Karuppiah
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Publication number: 20090320875Abstract: Embodiments described herein relate to semiconductor device manufacturing, and more particularly to a vertically oriented dual megasonic module for simultaneously cleaning multiple substrates. In one embodiment, an apparatus for cleaning multiple substrates is provided. The apparatus comprises an outer tank for collecting overflow processing fluid comprising at least one sidewall and a bottom. A first inner module adapted to contain a processing fluid is positioned partially within the outer tank. The first inner module comprises one or more roller assemblies to hold a substrate in a substantially vertical orientation. A second inner module adapted to contain a processing fluid is positioned partially within the outer tank. The second inner module comprises one or more roller assemblies adapted to hold a substrate in a substantially vertical orientation. Each inner module contains a transducer adapted to direct vibrational energy through the processing fluid toward the substrates.Type: ApplicationFiled: June 23, 2009Publication date: December 31, 2009Applicant: APPLIED MATERIALS, INC.Inventors: RICARDO MARTINEZ, Allen L. D'Ambra, Adrian Blank, Thuy Britcher, Hui Chen