Abstract: A controller includes an internal memory to store an address and a memory control unit operatively coupled with the internal memory. The memory control unit includes logic to identify a malfunctioning address of primary data storage elements within an external memory device, the external memory device being another semiconductor device separate from the controller, store the malfunctioning address in the internal memory, and transmit, to the external memory device, a command to initiate a repair of the malfunctioning address using redundant data storage elements and an indication of an address associated with the malfunctioning address.

Abstract: A controller includes a memory test logic circuit to detect a malfunctioning row of primary data storage elements within an external memory device, an internal memory to store an address corresponding to the malfunctioning row of the external memory device, and a memory setup logic circuit to initiate a repair mode in the external memory device and to end the repair mode in the external memory device. The controller further includes a port to couple to an address line to transmit the address corresponding to the malfunctioning row of the external memory device.

Abstract: A controller includes an internal memory to store an address and a memory control unit operatively coupled with the internal memory. The memory control unit includes logic to identify a malfunctioning address of primary data storage elements within an external memory device, the external memory device being another semiconductor device separate from the controller, store the malfunctioning address in the internal memory, and transmit, to the external memory device, a command to initiate a repair of the malfunctioning address using redundant data storage elements and an indication of an address associated with the malfunctioning address.

Abstract: Systems and methods of testing integrated circuits are disclosed. A system may include a data compression component to compress data received from an integrated circuit under test at a first clock frequency, to generate compressed data. The system may also include a data output component, operatively coupled to the data compression component, to convey the compressed data to automated testing equipment at a second clock frequency.

Abstract: A controller includes a memory test logic circuit to detect a malfunctioning row of primary data storage elements within an external memory device, an internal memory to store an address corresponding to the malfunctioning row of the external memory device, and a memory setup logic circuit to initiate a repair mode in the external memory device and to end the repair mode in the external memory device. The controller further includes a port to couple to an address line to transmit the address corresponding to the malfunctioning row of the external memory device.

Abstract: A system implementing parallel memory error detection and correction divides data having a word length of K bits into multiple N-bit portions. The system has a separate error processing subsystem for each of the N-bit portions, and utilizes each error processing subsystem to process the associated N-bit portion of the K-bit input data. During memory write operations, each error processing subsystem generates parity information for the N-bit data, and writes the N-bit data and parity information into a separate memory array that corresponds to the error processing subsystem. During memory read operations, each error processing subsystem reads N-bits of data and the associated parity information. If, based on the parity information, an error is detected from the N-bit data, the error processing subsystem attempts to correct the error. The corrected N-bit data from each of the error processing subsystems are combined to reproduce the K-bit word.

Abstract: A controller including a non-volatile memory to store a repair address, and a memory control unit operatively coupled with the non-volatile memory. The memory control unit comprising a memory test function configured to detect a malfunctioning address of primary data storage elements within a memory device. The memory device being another semiconductor device separate from the controller. The memory test function configured to store the repair address in the non-volatile memory, the repair address indicating the malfunctioning address of the primary data storage element.

Abstract: Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher slew rate than the slew rate at which signals are received from the automated testing equipment.

Abstract: An adaptive dual voltage memory write driver system can include an adaptive write voltage generator circuit to provide a first adjustable write voltage and to provide a second adjustable write voltage. The adaptive dual voltage memory write driver system can include an array of dummy memory cells coupled to the adaptive write voltage generator circuit and configured to provide resistive path tracking information to the adaptive write voltage generator circuit. The adjustable write voltages can be automatically increased or decreased responsive to the resistive path tracking information. A tri-state write driver circuit can provide a first adjustable write voltage source for writing “0”s and a second adjustable write voltage source for writing “1”s. A method for generating adjustable memory write voltages using dummy resistive path tracking may include receiving resistive path tracking information from a dummy section, and generating adjustable write voltages based on the resistive path tracking information.

Abstract: A non-volatile static random access memory cell and includes a bistable regenerative circuit coupled to first and second transistors and to first and second non-volatile memory cells. Methods of use include directly transferring a complementary data bit between the non-volatile memory cell and the bistable regenerative circuit. Alternatively, complementary data from the bistable regenerative circuit may be regenerated by a sense amplifier and a second bistable regenerative circuit before being transferred to non-volatile memory cells in a column of memory cells. The bistable regenerative circuit may be reset to ground potential. Applications using the non-volatile SRAM cell with direct read out from the bistable regenerative circuit include a non-volatile flip-flop or non-volatile multiplexer.

Abstract: A magnetic memory includes memory array tiles (MATs), intermediate circuitry, global bit lines and global circuitry. Each MAT includes bit lines, word lines, and magnetic storage cells having magnetic junction(s), selection device(s) and at least part of a spin-orbit interaction (SO) active layer adjacent to the magnetic junction(s). The SO active layer exerts a SO torque on the magnetic junction(s) due to a preconditioning current passing through the SO active layer. The magnetic junction(s) are programmable using write current(s) driven through the magnetic junction(s) and the preconditioning current. The bit and word lines correspond to the magnetic storage cells. The intermediate circuitry controls read and write operations within the MATs. Each global bit line corresponds to a portion of the MATs. The global circuitry selects and drivesportions of the global bit lines for read operations and write operations.

Abstract: A non-volatile memory (NVM) system compatible with double data rate, single data rate, or other high speed serial burst operation. The NVM system includes input and output circuits adapted to synchronously send or receive back-to-back continuous bursts of serial data at twice the frequency of any clock input. Each burst is J bits in length. The NVM system includes read and write circuits that are adapted to read or write J bits of data at a time and in parallel, for each of a multitude of parallel data paths. Data is latched such that write time is similar for each bit and is extended to the time it takes to transmit an entire burst. Consequently, the need for small and fast sensing circuits on every column of a memory array, and fast write time at twice the frequency of the fastest clock input, are relieved.

Abstract: An adaptive dual voltage memory write driver system can include an adaptive write voltage generator circuit to provide a first adjustable write voltage and to provide a second adjustable write voltage. The adaptive dual voltage memory write driver system can include an array of dummy memory cells coupled to the adaptive write voltage generator circuit and configured to provide resistive path tracking information to the adaptive write voltage generator circuit. The adjustable write voltages can be automatically increased or decreased responsive to the resistive path tracking information. A tri-state write driver circuit can provide a first adjustable write voltage source for writing “0”s and a second adjustable write voltage source for writing “1”s. A method for generating adjustable memory write voltages using dummy resistive path tracking may include receiving resistive path tracking information from a dummy section, and generating adjustable write voltages based on the resistive path tracking information.

Abstract: An embodiment includes a three terminal magnetic element for a semiconductor memory device. The magnetic element includes a reference layer; a free layer; a barrier layer disposed between the reference layer and the free layer; a first electrode; an insulating layer disposed between the electrode and the free layer; and a second electrode coupled to sidewalls of the free layer.

Abstract: Methods, systems, and apparatus for testing semiconductor devices.

Abstract: A magnetic memory includes memory array tiles (MATs), intermediate circuitry, global bit lines and global circuitry. Each MAT includes bit lines, word lines, and magnetic storage cells having magnetic junction(s), selection device(s) and at least part of a spin-orbit interaction (SO) active layer adjacent to the magnetic junction(s). The SO active layer exerts a SO torque on the magnetic junction(s) due to a preconditioning current passing through the SO active layer. The magnetic junction(s) are programmable using write current(s) driven through the magnetic junction(s) and the preconditioning current. The bit and word lines correspond to the magnetic storage cells. The intermediate circuitry controls read and write operations within the MATs. Each global bit line corresponds to a portion of the MATs. The global circuitry selects and drives portions of the global bit lines for read operations and write operations.

Abstract: A controller including a non-volatile memory to store a repair address, and a memory control unit operatively coupled with the non-volatile memory. The memory control unit comprising a memory test function configured to detect a malfunctioning address of primary data storage elements within a memory device. The memory device being another semiconductor device separate from the controller. The memory test function configured to store the repair address in the non-volatile memory, the repair address indicating the malfunctioning address of the primary data storage element.

Abstract: An embodiment includes a three terminal magnetic element for a semiconductor memory device. The magnetic element includes a reference layer; a free layer; a barrier layer disposed between the reference layer and the free layer; a first electrode; an insulating layer disposed between the electrode and the free layer; and a second electrode coupled to sidewalls of the free layer.

Abstract: A smart memory system preferably includes a memory including one or more memory chips, and a processor including one or more memory processor chips. The system may include a smart memory controller capable of performing a bit error rate built-in self test. The smart memory control may include bit error rate controller logic configured to control the bit error rate built-in self test. A write error rate test pattern generator may generate a write error test pattern for the bit error rate built-in self test. A read error rate test pattern generator may generate a read error test pattern for the built-in self test. The smart memory controller may internally generate an error rate timing pattern, perform built-in self test, measure the resulting error rate, automatically adjust one or more test parameters based on the measured error rate, and repeat the built-in self test using the adjusted parameters.

Abstract: Circuit includes, in part, random access memory cells, column decoders, row decoders, and write driver circuit. Driver circuit is responsive to data and control signals. Writing data includes multiple write phases, each phase driving predetermined current through selected cell by driver setting predetermined voltages to first and second lines. Voltages are in sets such that sequential voltages of each set correspond to respective phase. During writing of first data to selected cell, driver circuit causes first signal line to be at second voltage set and second signal line to be at first voltage set. Second voltage set is greater than first voltage set. During writing of second data to selected cell, driver cause first signal line to be at third voltage set and second signal line to be at fourth voltage set. Third voltage set is smaller than the fourth voltage set.