Patents by Inventor Adrian Fung

Adrian Fung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal management apparatus and method for a circuit substrate
    Patent number: 7623349
    Abstract: The present disclosure relates to thermal management apparatus for a circuit substrate having heat generating components mounted on one or both sides thereof. The apparatus and method includes a circuit assembly having a first thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to one or more heat generating components of the circuit substrate. The apparatus and method includes a second thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to the first thermally conductive layer. The first thermally conductive layer and the thermally conductive layer can be shaped, sized, and/or configured to provide cooling of the one or more heat generating components disposed on each side of the circuit substrate by transferring and spreading the heat to the outside of the circuit assembly.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: November 24, 2009
    Assignee: ATI Technologies ULC
    Inventors: Gamal Refai-Ahmed, John Shaw, Adrian Fung
  • THERMAL MANAGEMENT APPARATUS AND METHOD FOR A CIRCUIT SUBSTRATE
    Publication number: 20060198108
    Abstract: The present disclosure relates to thermal management apparatus for a circuit substrate having heat generating components mounted on one or both sides thereof. The apparatus and method includes a circuit assembly having a first thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to one or more heat generating components of the circuit substrate. The apparatus and method includes a second thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to the first thermally conductive layer. The first thermally conductive layer and the thermally conductive layer can be shaped, sized, and/or configured to provide cooling of the one or more heat generating components disposed on each side of the circuit substrate by transferring and spreading the heat to the outside of the circuit assembly.
    Type: Application
    Filed: March 7, 2005
    Publication date: September 7, 2006
    Applicant: ATI TECHNOLOGIES, INC.
    Inventors: GAMAL REFAI-AHMED, JOHN SHAW, ADRIAN FUNG