Patents by Inventor Adrian GARNER

Adrian GARNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND METHODS FOR PRODUCING NON-STANDARD SHAPED CARDS
    Publication number: 20230244897
    Abstract: Example embodiments of systems and methods for card production are provided. A card may include processing circuitry including a chip and memory. The card may include one or more antennas in communication with the chip. The card may include a first layer of material aligned within a perimeter of the card via laminate encapsulation. The first layer of material may comprise a non-rectangular shape. The first layer of material may be offset with a shape of the card. The first layer of material may be in communication with the chip. The first layer of material may comprise at least one selected from the group of steel, tungsten, titanium, or any combination thereof. The card may be compliant with one or more form factors.
    Type: Application
    Filed: April 11, 2023
    Publication date: August 3, 2023
    Inventors: Daniel HERRINGTON, Suzanne PARKER, Adrian GARNER, Lin Ni Lisa CHENG
  • Systems and methods for producing non-standard shaped cards
    Patent number: 11651184
    Abstract: Example embodiments of systems and methods for card production are provided. A card may include processing circuitry including a chip and memory. The card may include one or more antennas in communication with the chip. The card may include a first layer of material aligned within a perimeter of the card via laminate encapsulation. The first layer of material may comprise a non-rectangular shape. The first layer of material may be offset with a shape of the card. The first layer of material may be in communication with the chip. The first layer of material may comprise at least one selected from the group of steel, tungsten, titanium, or any combination thereof. The card may be compliant with one or more form factors.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: May 16, 2023
    Assignee: CAPITAL ONE SERVICES, LLC
    Inventors: Daniel Herrington, Suzanne Parker, Adrian Garner, Lin Ni Lisa Cheng
  • SYSTEMS AND METHODS FOR PRODUCING NON-STANDARD SHAPED CARDS
    Publication number: 20210383184
    Abstract: Example embodiments of systems and methods for card production are provided. A card may include processing circuitry including a chip and memory. The card may include one or more antennas in communication with the chip. The card may include a first layer of material aligned within a perimeter of the card via laminate encapsulation. The first layer of material may comprise a non-rectangular shape. The first layer of material may be offset with a shape of the card. The first layer of material may be in communication with the chip. The first layer of material may comprise at least one selected from the group of steel, tungsten, titanium, or any combination thereof. The card may be compliant with one or more form factors.
    Type: Application
    Filed: August 18, 2021
    Publication date: December 9, 2021
    Inventors: Daniel HERRINGTON, Suzanne PARKER, Adrian GARNER, Lin Ni Lisa CHENG
  • Systems and methods for producing non-standard shaped cards
    Patent number: 11132594
    Abstract: Example embodiments of systems and methods for card production are provided. A card may include processing circuitry including a chip and memory. The card may include one or more antennas in communication with the chip. The card may include a first layer of material aligned within a perimeter of the card via laminate encapsulation. The first layer of material may comprise a non-rectangular shape. The first layer of material may be offset with a shape of the card. The first layer of material may be in communication with the chip. The first layer of material may comprise at least one selected from the group of steel, tungsten, titanium, or any combination thereof. The card may be compliant with one or more form factors.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: September 28, 2021
    Assignee: CAPITAL ONE SERVICES, LLC
    Inventors: Daniel Herrington, Suzanne Parker, Adrian Garner, Lin Ni Lisa Cheng
  • SYSTEMS AND METHODS FOR PRODUCING NON-STANDARD SHAPED CARDS
    Publication number: 20210209435
    Abstract: Example embodiments of systems and methods for card production are provided. A card may include processing circuitry including a chip and memory. The card may include one or more antennas in communication with the chip. The card may include a first layer of material aligned within a perimeter of the card via laminate encapsulation. The first layer of material may comprise a non-rectangular shape. The first layer of material may be offset with a shape of the card. The first layer of material may be in communication with the chip. The first layer of material may comprise at least one selected from the group of steel, tungsten, titanium, or any combination thereof. The card may be compliant with one or more form factors.
    Type: Application
    Filed: January 3, 2020
    Publication date: July 8, 2021
    Inventors: Daniel HERRINGTON, Suzanne PARKER, Adrian GARNER, Lin Ni Lisa CHENG