Abstract: A measuring device for measuring parameters of a piezoelectric crystal onto which a thin film of material is deposited (under vacuum). The crystal includes two spaced-apart electrodes. A frequency generator is adapted to generate an oscillator signal at a specified output frequency. A measuring amplifier is adapted to apply the oscillator signal as a drive signal to one of the electrodes of the crystal and to provide a crystal output signal in response to the drive signal. A quadrature demodulator is adapted to down convert the crystal output signal and to provide an in-phase output signal and a quadrature output signal. A computation unit is adapted to determine one or more parameters of the crystal based on the in-phase output signal and the quadrature output signal. Furthermore, there is provided a corresponding measuring method as well as to thin-film deposition systems (including a vacuum chamber) with such a device and methods for controlling such systems.

Abstract: A measuring device for measuring parameters of a piezoelectric crystal onto which a thin film of material is deposited (under vacuum). The crystal includes two spaced-apart electrodes. A frequency generator is adapted to generate an oscillator signal at a specified output frequency. A measuring amplifier is adapted to apply the oscillator signal as a drive signal to one of the electrodes of the crystal and to provide a crystal output signal in response to the drive signal. A quadrature demodulator is adapted to down convert the crystal output signal and to provide an in-phase output signal and a quadrature output signal. A computation unit is adapted to determine one or more parameters of the crystal based on the in-phase output signal and the quadrature output signal. Furthermore, there is provided a corresponding measuring method as well as to thin-film deposition systems (including a vacuum chamber) with such a device and methods for controlling such systems.

Abstract: In a vacuum treatment recipient, a plasma is generated between a first plasma electrode and a second plasma electrode so as to perform a vacuum plasma treatment of a substrate. To minimize at least one of the two plasma electrodes to be buried by a deposition of material resulting from the treatment process, that electrode is provided with a surface pattern of areas which do not contribute to the plasma electrode effect and of areas which are plasma electrode effective. The current path between the two electrodes is concentrated on the distinct areas which are plasma electrode effective, leading to an ongoing sputter- cleaning of these areas.