Abstract: Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements.

Abstract: Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements.

Abstract: Systems and methods for detecting the magnetic field created by a magnetic target. An arrangement of multiple magnetic field sensing elements and circuit elements configured to select and/or interpolate between the sensing elements to give enhanced performance and to compensate for external mechanical factors. The circuit arrangement is integrated on a single silicon chip to form an integrated circuit sensing device in one embodiment.

Abstract: Systems and methods for detecting the magnetic field created by a magnetic target. An arrangement of multiple magnetic field sensing elements and circuit elements configured to select and/or interpolate between the sensing elements to give enhanced performance and to compensate for external mechanical factors. The circuit arrangement is integrated on a single silicon chip to form an integrated circuit sensing device in one embodiment.

Abstract: An apparatus for providing three dimensional positioning to the ends of one or more translating elements which are normally restricted to translation along the longitudinal axes of the elements. A cartridge assembly including a cylinder at least partially formed of a ceramic element holds the translating element at an angle to the center axis of the cylinder. The cartridge assembly rotates within a cylindrically shaped chamber in a lid assembly. The lid assembly is mounted on the port of a chamber where the translating element is to be positioned, thereby allowing the translating element to extend into the chamber. The center axis of the cylindrical chamber of the lid assembly is at an angle to the center axis of the port of the chamber. A rotational drive unit rotates the cartridge assembly within the lid assembly. A translational drive unit longitudinally drives the translating element within the cartridge assembly.