Patents by Inventor Adrian LIS

Adrian LIS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGES INCLUDING RECESSES TO CONTAIN SOLDER
    Publication number: 20220415745
    Abstract: One example of a semiconductor package includes a first substrate, a second substrate, a semiconductor die, and a spacer. The semiconductor die is attached to the first substrate. The spacer is attached to the semiconductor die and attached to the second substrate via solder. A surface of the second substrate facing the spacer includes a plurality of recesses extending from proximate at least one edge of the spacer to contain a portion of the solder.
    Type: Application
    Filed: June 29, 2021
    Publication date: December 29, 2022
    Applicant: Infineon Technologies AG
    Inventors: Adrian LIS, Michael LEDUTKE
  • PACKAGE WITH PAD HAVING OPEN NOTCH
    Publication number: 20220102299
    Abstract: A package is disclosed. In one example, the package comprises an electronic component having a first main surface with an electrically conductive first pad. The first pad has an open notch, and a spacer body mounted on the first pad and bridging at least part of the open notch.
    Type: Application
    Filed: September 28, 2021
    Publication date: March 31, 2022
    Applicant: Infineon Technologies AG
    Inventor: Adrian LIS