Abstract: A method for manufacturing a camera module array, made up of at least two camera modules, each camera module including a circuit carrier, an image sensor and at least one optical element, including: mounting the image sensor on the circuit carriers; applying a protective layer to the circuit carriers, the image sensors not being covered by the protective layer or being left exposed; and mounting the optical elements on the image sensors with the aid of an injection molding process and/or embossing process.

Abstract: A method for manufacturing a camera module, the camera module including a circuit carrier, an image sensor and an optical system holder, including: mounting the image sensor on the circuit carrier; applying a protective layer to the circuit carrier, in which the image sensor is not covered by the protective layer and the protective layer simultaneously forms the optical system holder.

Abstract: A sensor device for a vehicle for detecting vehicle dimensions and/or pieces of vehicle surroundings information and a method for manufacturing such a sensor device. The sensor device includes at least one sensor unit for measuring corresponding vehicle dimensions and/or pieces of vehicle surroundings information, and a housing which at least partially encloses the sensor unit, the housing being at least partially formed by a ceramic casting compound, so that the housing may be manufactured in an unpressurized casting step, with exemption of sensor surfaces of the sensor unit.

Abstract: A method for manufacturing a camera module array, made up of at least two camera modules, each camera module including a circuit carrier, an image sensor and at least one optical element, including: mounting the image sensor on the circuit carriers; applying a protective layer to the circuit carriers, the image sensors not being covered by the protective layer or being left exposed; and mounting the optical elements on the image sensors with the aid of an injection molding process and/or embossing process.

Abstract: A method for manufacturing a camera module, the camera module including a circuit carrier, an image sensor and an optical system holder, including: mounting the image sensor on the circuit carrier; applying a protective layer to the circuit carrier, in which the image sensor is not covered by the protective layer and the protective layer simultaneously forms the optical system holder.