Abstract: A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 12 weight percent, all based on weight of the curable silicone composition; wherein the curable silicone composition has a concentration of the Cu—Ag core-shell particles and hydrocarbon vehicle such that the curable silicone composition remains curable to a conductive silicone material having a concentration of the Cu—Ag core-shell particles of from 88.0 to 92 weight percent and having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method, and a thermal conductivity of greater than or equal to 2.9 Watts per meter*Kelvin (W/(m*K)) measured according to Thermal Properties Test Method.

Abstract: A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 12 weight percent, all based on weight of the curable silicone composition; wherein the curable silicone composition has a concentration of the Cu—Ag core-shell particles and hydrocarbon vehicle such that the curable silicone composition remains curable to a conductive silicone material having a concentration of the Cu—Ag core-shell particles of from 88.0 to 92 weight percent and having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method, and a thermal conductivity of greater than or equal to 2.9 Watts per meter*Kelvin (W/(m*K)) measured according to Thermal Properties Test Method.

Abstract: A composition comprises a metal powder. The composition further comprises a solder powder which has a lower melting temperature than a melting temperature of the metal powder. The composition further comprises a polymer and a carboxylated-polymer different from the polymer. The carboxylated-polymer is useful for fluxing the metal powder and cross-linking the polymer. The composition further comprises a dicarboxylic acid and a monocarboxylic acid. The acids are useful for fluxing the metal powder. The composition may be used for forming a conductor. The conductor may be used for current trans and/or electrical connection. An article comprises a substrate and the conductor disposed on and in electrical contact with the substrate. The article may be used for various applications, such as for converting light of many different wavelengths into electricity. Examples of such articles include photovoltaic (PV) cells and circuit boards.

Abstract: A photovoltaic cell comprises a base substrate comprising silicon and including a rear region. A first electrode is disposed on, and is in electrical communication with, the rear region, and comprises a first metal present in the first electrode in a majority amount. A second electrode is spaced from the rear region such that the rear region is free of physical contact with the second electrode. The second electrode is in electrical contact with the first electrode. The second electrode comprises a polymer, a second metal present in the second electrode in a majority amount, and a third metal different from the first and second metals. The third metal has a melting temperature of no greater than about 300° C. The rear region is in electrical communication with the second electrode via the first electrode. A method of forming the PV cell is also provided.

Abstract: A photovoltaic (PV) cell comprises a base substrate comprising silicon and including an upper doped region. A coating layer is disposed on the upper doped region and has an outer surface. Fingers are disposed in the coating layer. Each finger has a lower portion in electrical contact with the upper doped region, and an upper portion extending outwardly through the outer surface. Each finger comprises a first metal. A busbar is spaced from the upper doped region, which is free of physical contact with the busbar. The busbar is in electrical contact with the upper portions of the fingers. The busbar comprises a second metal and a third metal different from the first and second metals. The third metal has a melting temperature of no greater than about 300° C. A method of forming the PV cell is also provided.