Patents by Inventor Adriane Cabral Ginez

Adriane Cabral Ginez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190200452
    Abstract: According to some aspects of the present disclosure, circuit board assemblies are disclosed. Example circuit board assemblies include a printed circuit board having a first surface and a second surface, and defining an opening having at least one side extending from the first surface to the second surface. The assembly also includes a bus bar having a first surface, a second surface, and at least one side. The bus bar is secured in the opening of the printed circuit board via a press-fit, such that a slot is defined between the at least one side of the bus bar and the at least one side of the opening defined by the printed circuit board. The assembly further includes an electrical lead positioned in the slot, and solder disposed between the electrical lead and the bus bar to electrically couple the electrical lead and the bus bar.
    Type: Application
    Filed: December 21, 2017
    Publication date: June 27, 2019
    Inventors: Edgardo Hernando Vergara, Adriane Cabral Ginez, Joel Cadiente Macadangdang
  • Patent number: 10314164
    Abstract: According to some aspects of the present disclosure, circuit board assemblies are disclosed. Example circuit board assemblies include a printed circuit board having a first surface and a second surface, and defining an opening having at least one side extending from the first surface to the second surface. The assembly also includes a bus bar having a first surface, a second surface, and at least one side. The bus bar is secured in the opening of the printed circuit board via a press-fit, such that a slot is defined between the at least one side of the bus bar and the at least one side of the opening defined by the printed circuit board. The assembly further includes an electrical lead positioned in the slot, and solder disposed between the electrical lead and the bus bar to electrically couple the electrical lead and the bus bar.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: June 4, 2019
    Assignee: Astec International Limited
    Inventors: Edgardo Hernando Vergara, Adriane Cabral Ginez, Joel Cadiente Macadangdang