Patents by Inventor Adriano M. Vilas-Boas

Adriano M. Vilas-Boas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip module for battery power control
    Patent number: 8003447
    Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: August 23, 2011
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Edwin Man Fai Lee, David Chong Sook Lim, Adriano M. Vilas-Boas
  • MULTI-CHIP MODULE FOR BATTERY POWER CONTROL
    Publication number: 20110078899
    Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
    Type: Application
    Filed: December 9, 2010
    Publication date: April 7, 2011
    Inventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Lee Man Fai Edwin, David Chong Sook Lim, Adriano M. Vilas-Boas
  • Multi-chip module for battery power control
    Patent number: 7868432
    Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: January 11, 2011
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Lee Man Fai Edwin, David Chong Sook Lim, Adriano M. Vilas-Boas
  • MULTI-CHIP MODULE FOR BATTERY POWER CONTROL
    Publication number: 20070187807
    Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
    Type: Application
    Filed: February 8, 2007
    Publication date: August 16, 2007
    Inventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Lee Man Fai Edwin, David Chong Sook Lim, Adriano M. Vilas-Boas